
Originally Posted by
Chumbucket843
die size rumours???
what is there to question??
nVidia openly disclosed that Fermi is 3B transistors.
We also know G200 was 1.4 billion transistors covering a 576mm2 die surface area built on a 65nm process.
Put 2 and 2 together. Its a virtual certainty that Fermi die size will be very large (about as big), and the corresponding heat, power, and yield issues that come with that.
Nobody in the history of silicon has doubled yields by making a 2x bigger chip.
FUN nVidia GPU CLOCK STAT:
Remember GF2.. 175, 200, 225Mhz
GF4.. 250, 275, 300Mhz
GF6.. 325, 350, 400, 425Mhz - notice a pattern yet?
GF8.. 513? 575, 600, 612, 650 - ok a few bad ones..
G200... 633, 602, 612, 648, 576, 738... umm.. what was wrong with nice even spaced 25Mhz increments?
according to wikipedia (ie 9 year old):
Code:
GeForce GTX 470 March 2010 GF100 40 3000 576? 1 PCI-E x16 2.0 1280 448:56:40 GDDR5 320 11 3.2
GeForce GTX 480 March 2010 GF100 40 3000 576? 1 PCI-E x16 2.0 1536 512:64:48 GDDR5 384 11 3.2
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