2009, TMSC 40nm for graphics alone: HD4770, nVidia GTS220, GTS240, HD58xx, HD57xx
Now in Jan, add HD56xx/HD55xx.
Seems like getting 2 millions shipped units would be tough sharing capacity for all these different chips. But 2 million is a drop in the bucket compared to global PC sales (most of which are notebooks) of HUNDREDS of millions annually.
Lets assume the 2 million is HD58xx only. It launched Sept 23, 4 months ago. So about 500 000 / month. Each chip is 334mm^2. 300mm wafer has area of about 70 680mm^2. Thats 211 (although some are cutoff). Conservatively Guess-timate by multiplying by 20% (not yield), we get 42.
So our worst case scenario is 11 900 wafers per month. Well bellow the 40 000 wafers / month capacity.
In reality most shipments have surely been the "low end" HD57xx which has tiny 166mm^2 die size. With only 6000 wafers per month, AMD could have easily shipped 2 million DX11 products.







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