The GT300/Fermi Thread

[LordEC911]

~550-580mm2 die size on 40nm, about the same size as 65nm G200.
512 "CUDA cores"
~1.5TFlops of SP and ~768GFlops of DP, depending on final clocks.
48ROPs

10.5" board for GF100.
Core clocks <750mhz and shader <1700mhz, expect similar clocks to GTX280/GTX285. <5ghz GDDR5 on a 384bit bus, giving <240GBps.
TDP of ~225-250w.

A lower binned, cutdown and down clocked variant with a TDP of ~170w is expected if they are planning a dual GPU board before an optical shrink.

Early performance estimates put it at a 20-40% advantage over HD5870.

[SamHughe]

~550-580mm2 die size on 40nm, about the same size as 65nm G200.
512 "CUDA cores"
~1.5TFlops of SP and ~768GFlops of DP, depending on final clocks.
48ROPs

10.5" board for GF100.
Core clocks <750mhz and shader <1700mhz, expect similar clocks to GTX280/GTX285. <5ghz GDDR5 on a 384bit bus, giving <240GBps.
TDP of ~225-250w.

A lower binned, cutdown and down clocked variant with a TDP of ~170w is expected if they are planning a dual GPU board before an optical shrink.

Early performance estimates put it at a 20-40% advantage over HD5870.

Source?

[Sadasius]

How ironic this is called the 'Fermi' thread. Basically it entails that it will have a meltdown or it will produce a sizable amount of energy. But seriously...any sources for anything concrete?