yeah same thing... and remember? i had a feeling theres something up with the vss pads before in that thread, if you look at the burn marks on some of the pics posted, it actually looks as if at least vcc AND vss pins got too hot, if not mostly vss pins actually! whats interesting is the ratio of 2 vcc to 1 vss pads which seems odd to me, but even moreso, the vss pads dont have any small dimples in them. do you know what those are actually for? i figured they might be to prevent the pins from sliding off the pads, instead the pin would slide into one of the dimples and be stuck there? but why do only vss pads have those and not vss?

so it seems that vcc and vss pads are clearly diferent from one another, and maybe pins are specced to be slightly different too?
maybe the intel spec asks for vcc pins to be stronger than vss pins, and while foxconn actually did implement different pin strengths, everybody else went the easy route and used the same pins for vcc and vss... which in this case might have saved them from the problems the foxconn sockets are seing?

meh, i dont know enough about this stuff to speculate, hahaha i better shut up