Ah, you meant heat. You originally said water molecules pick up other molecules, which made me go
Assuming each molecule can pick up a certain amount of heat, taking into account inefficiencies, the more molecules you have impacting the die surface in a given period, the more heat can be removed - thermal transfer efficiency for a set silicon/water molecule pair decreases exponentially over time. Even if silicon wafers are hydrophilic, there isn't some set number of molecules that will be "allowed" to contact the surface - you've just got to overcome additional inefficiencies caused by the repulsion of X water molecules.
Although really, any hydrophilic effect will be miniscule in comparison to the surface-area issue.











Reply With Quote
*

Talking about 'utilizing' the heat-carrying capacity of water molecules is starting to sound a lot like the old low-flow arguments - shouldn't the water spend more time in the CPU block/rad so it can pick up more heat? Fact is, as long as that water in the block is actually hitting the die (so we're assuming injector design here, not CPU-block-as-mini-reservoir as you put it), while each molecule may pick up less total heat because it isn't in contact with the die for as long, because thermal efficiency decreases exponentially with time, each molecule has a higher heat-pickup-rate-per-time-unit, because we aren't progressing as far down the heat/time efficiency curve. Given that, and that we effectively have an unlimited supply of water molecules, more flow will give you better temps, as you have a higher total rate of heat pickup from the die surface.

Bookmarks