Ok so we have some that work and some that don't here. I would submit this. I have taken apart many cards to re- tim them with silver or diamond based tims. I have found many times that the factory had installed heatsinks where there was little and in some cases, NO contact in some areas between heatsink and surfaces to be cooled. So could some guys maybe take apart cards to see just how well they have thier thermal compounds or pads installed. Could this be a case of some cards having enough contact or compound to work under normal conditions(meeting factory specs minimum) but not enough to remove heat quick enough for this test? Just sayin.