i cant tell you how i would do it, otherwise i would have done such reviews. and yes i can criticize even if i have no better suggestion.
let's see.
- get a thermometer that measures down to 0.1°C accuracy (not resolution) at least. better is 0.01°C. yes that will be expensive.
- get a proper controllable environment. temperature kept within 0.1°C - solutions exist for that but pricey again. or get a good probe and normalize the temps (not that good)
- have one cpu to measure tcase with a probe (like hardocp did)
- use realtemp on a different cpu, calibrate it using proper equipment (no not an IR thermometer)
- alternatively figure out a way to hook up a thermometer to the on-die diode inside the cpu. possible, i've done it for athlon64
- ensure that the ihs' are evenly flat on both cpus
- test dual core, quad core, i7 cpus (could be 3 reviews)
- use at least 2 heatsinks to qualify if there is a difference
- ensure to always use the same mounting pressure (spring mounting is good for that)
- ensure proper cleaning of the heatsink base, maybe sand it down for every measurement so you have no residue from other pastes?
- repeat application, measurement and cure in 3 to 5 times
- devise a method how to apply the same thickness/spread of thermal paste every single time
- possibly look at several different batches of the same paste.
expect to spend at least a few thousand $ for equipment and several hundred hours to get everything figured out and get results.
one question for you to think about: what is the cpu temperature? its case? where on the case? on the die? where on the die? the package maybe? but where? which thermal gradients exist between those three?
is it better to favour low temperatures or better overclocking potential in thermal pastes? maybe add some oc tests.







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