Quote Originally Posted by Uncle Jimbo View Post



If AMD follows past practice, they will add higher end parts once they see what the bin split is from volume production... My suspicion is that the 140W TDP for platform designers was to accommodate higher power parts as a straight swap with no other changes, since the 3G parts are obviously way below that dissipation. Based on what happened with Barcelona, I think AMD is wise to under-promise and over-deliver this time around.
They've been working on this for years and tape out had to of been at least over a year, I'm sure they know what their process can do by now. I think that it's too close to release to debate so I guess we will see.