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Thread: Deneb vs Agena..feel Free to "speculate"

  1. #26
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    Quote Originally Posted by gallag View Post
    Something is not right with this, There is no way that 1.475v on a non highk process will max out at 53c on air, It just is not possible.
    Well, I think it is within the realm of possibility. Informal was kind enough to post some comments that help illuminate AMD's recent effort.

    Quote Originally Posted by informal View Post
    Oh man you just made my day ,that was soo funny
    AMDzone is in for a ride .

    Anyhow i searched the spec.org for any newer additions on the SH Opterons and had no luck .Maybe the other results will come on the night of the official launch(next Wednesday).
    ADVANCED MICRO DEVICES INC.
    AMD seeks redemption - and sales - with Shanghai
    Chipmaker used lessons of Barcelona in revamping design process

    By Kirk Ladendorf
    AMERICAN-STATESMAN STAFF
    Monday, November 10, 2008

    To the outside world, Advanced Micro Devices Inc. calls its latest chip Shanghai. To the engineering team, the usual name for the project is Ridgeback. But the real name for this chip could be "Redemption."

    AMD wants to restore some of the luster to its image that was lost when its last flagship chip, Barcelona, was months late and plagued by embarrassing bugs.

    The chipmaker was counting on Barcelona to revive its sagging fortunes in its perennial battle with Intel Corp., the kingpin of the microprocessor market.

    But Barcelona's public problems had the opposite effect. They cost AMD heavily in lost revenue, lost profits, lost morale and lost confidence from its customers.

    Now comes Shanghai and the hope for a recovery of reputation and, maybe, sales.

    The new chip began shipping to computer makers in October and will become the brain of new servers that show up this month. The formal unveiling is Thursday.

    Shanghai is similar to Barcelona, but there have been dozens of enhancements, including the addition of larger on-board memory caches to spur performance.

    AMD says the chip will quickly become the standard setter for Windows-compatible server chips, although Intel will counter with its own high-performance chips in the weeks ahead.

    "I am delighted with the chip," said Jeff VerHeul , AMD's vice president of silicon design. He cited the reasons: "A, it is early; B, it has greater-than-expected performance; and, most importantly, our customers like it."

    He backs the assertion of CEO Dirk Meyer , who called the new chip "the best server product on the market."

    The company has yet to deliver precise performance metrics, but VerHeul said Shanghai will deliver roughly 20 percent more performance than Barcelona while running at the same speed. Plus, it will run faster.

    The new chip, like Barcelona, contains four processing engines, or cores, but it is far more complex because it is made with a more advanced manufacturing process.

    Analysts are not quite as enthusiastic as AMD.

    "They need to rebuild their reputation and re-establish credibility," said Nathan Brookwood with Insight 64. "They need to demonstrate that they are executing and delivering on their promises. This should help there."

    AMD is aiming for a financial rebound as well after two years of losses. The chipmaker has sold some nonproductive operations and announced plans to spin off its German factory operations into a joint venture it will own with a sovereign investment company based in Abu Dhabi.

    In addition, the company announced last week that it had cut 500 jobs worldwide, including 154 in Austin, as part of an effort to cut operating costs as it aims for consistent profitability.

    The problems with Barcelona forced AMD's leadership to take an intense look at its design process and fix the flaws it found. Part of that fix involved a new procedure for designing complex, high-performance chips.

    In the past, the company relied mainly on one of its two major design centers in Austin or Sunnyvale, Calif. But the work on the new chip would be split among at least five design centers around the world: Austin; Sunnyvale; Fort Collins, Colo.; Dresden, Germany; and Bangalore, India.

    The first four centers would all work on key sections of the chip, and the design center in Bangalore, created in 2005, would be responsible for putting the pieces together in a complete design.

    The project was directed by a veteran AMD engineering manager Raghuram Tupuri, who moved to India in 2005 to get the Bangalore design center started. He returned to Austin last year.

    The approach was the brainchild of VerHeul, who dubbed it Centers of Excellence. He had tried a similar approach at IBM Corp. on engineering projects involving the design of servers.

    Splitting up a major chip design among several design centers can result in faster completion of the design, but VerHeul and Tupuri both say the approach requires extensive communications and personal rapport among the key players in the various far-flung design centers.

    "We had people from the various sites spend time together so they got to know each other," VerHeul said. "Developing personal relationships is very, very key."

    Tupuri said the global design effort came together as one big team, with engineers eventually feeling comfortable enough to call one another on important questions before, during and well after normal work hours.

    "We are standing on the shoulders of the Barcelona team and getting the benefit of the lessons we learned from Barcelona," Tupuri said. The engineers "wanted to succeed and put Barcelona behind them. They looked at Ridgeback definitely as a redemption."

    The key objective of the team was to check and recheck the design to improve the odds that the first silicon prototypes of the new design would function well. Achieving that goal saved months in the development cycle.

    "We were all keen on getting the first silicon healthy," Tupuri said. "If the first silicon is healthy, then the glide-path (to product launch) is set. Even if we delayed the tape-out (formal completion of the design), we wanted to get the first silicon right."

    If Shanghai is as good as advertised, then it should help boost AMD's sales of high-performance chips in the months ahead.

    But analyst Ashok Kumar with Collins Stewart LLC says the impact of the new chip might be muted by the weakening world economy, which has put a big dent in sales of servers to major corporate buyers.

    "Demand has fallen off a cliff," Kumar said. Shanghai "will let AMD hold its own in the current environment, which is the best they can do."
    AMD knows the stakes are high. They have to defend the server market and improve their desktop performance.
    Last edited by Jazzman; 11-10-2008 at 11:25 AM.
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    Quote Originally Posted by Mattskees View Post
    i haven't screwed around with it but maybe it's an AOD glitch? CPU-Z Says 1.68v. Which would be amazing if true
    AOD is accurate. The CPU-Z version is an old one that did not read phenom voltage correctly. (Note the Windows Aero feature clearly shows that both photos are part of the same cutout.)
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  3. #28
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    With no bearing on what it will perform like, Unless AMD have done something radical they will experience severe leakage with high volts on a non high k process. It could have 90% higher ipc but it will not change the fact that a deneb running at 4ghz with 1.474v will leak like crazy. Still though, I am just a builder by trade so what do I know, We will find out in a few days.

  4. #29
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    im having high hopes for this cpu does any think there is a cahnce it can beat yorkfield or wolfdale in gaming? what r the chances

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    Quote Originally Posted by VOID WARRANTY View Post
    im having high hopes for this cpu does any think there is a cahnce it can beat yorkfield or wolfdale in gaming? what r the chances
    I don't think it will beat it as gaming performance seems to be harder to extract, But I don't think that yorkies or wolfdales will beat deneb ether, Should be pretty close.

  6. #31
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    Quote Originally Posted by gallag View Post
    With no bearing on what it will perform like, Unless AMD have done something radical they will experience severe leakage with high volts on a non high k process. It could have 90% higher ipc but it will not change the fact that a deneb running at 4ghz with 1.474v will leak like crazy. Still though, I am just a builder by trade so what do I know, We will find out in a few days.
    This may explain why leakage is reduced:
    Ultra-low-k Dielectrics. In some later 45nm products, AMD plans on using ultralow-
    k dielectrics to reduce wire delays by as much as 15 percent and enable greater
    overall processor performance.
    Special thanks to RiverRicer who provided the SOURCE
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    Quote Originally Posted by Jazzman View Post
    This may explain why leakage is reduced:

    Special thanks to RiverRicer who provided the SOURCE
    it says "later"...it doesn't say the low-k dielectrics are going to be present in the initial 45nm products.

  8. #33
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    Quote Originally Posted by Jazzman View Post
    This may explain why leakage is reduced:

    Special thanks to RiverRicer who provided the SOURCE
    Will it help leakage? Also, This is a card they will play in the future and will not be a feature on AMD45nm for a while so it is slightly irrelevant.

  9. #34
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    1.168 sounds really too low. But on my System (9950BE on 790gx Gigabyte) AOD shows wrong voltage an CPU-Z shows the right.
    But I canīt believe... So letīs see!
    sorry for my bad english

  10. #35
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    Quote Originally Posted by ryboto View Post
    it says "later"...it doesn't say the low-k dielectrics are going to be present in the initial 45nm products.
    Quote Originally Posted by gallag View Post
    Will it help leakage? Also, This is a card they will play in the future and will not be a feature on AMD45nm for a while so it is slightly irrelevant.
    CLARIFICATION: To be clear, I was only speculating about how the OC'r who provided the snapshot could achieve 4.0Ghz on air at 53C under 4x 100% load. If this result is reproduced, then there must be new design elements that reduce leakage and heat. I just wanted to highlight a possibility.

    My main reason for posting this was RiverRicer's source. These design elements are clues as to what we might see in an FX version of Deneb, e.g. high-K metal gates.
    Last edited by Jazzman; 11-10-2008 at 12:24 PM. Reason: OC'r photo elaboration
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  11. #36
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    High-k is planned for H2/09, i.e. for the Istanbul 6 core chip. AMD stated this on one of the last press conferences.

    Quote Originally Posted by demonkevy666 View Post
    hhhhmmm let see all of deneb's new features

    1. HT3.1 3200mhz (like Icore7 i 3200mhz too) helps memopery mostly, maybe a little with GPU.
    What Du you mean with "memopery" ? Mem speed ? That is totally unaffected by the faster HT3 speed. Only exception are coherent memory transfers in Multiprocessor setups, but we are speaking about Deneb = 1P; not Shanghai, dont we ?

    To the 4 GHz screenshot:
    It is already from July:
    http://www.overclock.net/amd-cpus/35...enom-45nm.html

    Are there no new ones ?

    cheers

    Opteron146
    Last edited by Opteron146; 11-10-2008 at 12:43 PM.

  12. #37
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    well once a trust worthy site like toms gets there hands on it....were know what potential this chip has.....i want a review with deneb picked apart with an UNbiased view and benched to extreme conditions.. then the dark will come to lite...weather this is 4800 series come back...or just a cooler running phenom that clocks higher...cuz if i wanted that i would just water cool a 9950 black edition and do every thing i could to push to 3.5ghz...we need the performance claimed...with out any twists in how there calculating this gain...i dont like cpu performance spin doctors trying to market remanufactured crap in box... show me 15% clock for clock......
    Last edited by VOID WARRANTY; 11-10-2008 at 02:16 PM.

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    I dont know why you guys keep thinking anything is going to change AMD always disapoints us well be lucky to hit 3.6ghz stable .........and I heard the first batch has the erata bug again. If theres one thing I have learned about AMD is their claims are always exagerated by 10-15% so that means we will have no clock for clock increase and only higher overall processor speed......I hope Bulldozer does better










































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    If I dont get every single drop out of my cpu I feel like someone is stealing from me

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    Heh. I was already rolling up my sleeves and breaking out the brass knuckles.
    Particle's First Rule of Online Technical Discussion:
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    Quote Originally Posted by Particle View Post
    Heh. I was already rolling up my sleeves and breaking out the brass knuckles.
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    If I dont get every single drop out of my cpu I feel like someone is stealing from me

  16. #41
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    Quote Originally Posted by Particle View Post
    Heh. I was already rolling up my sleeves and breaking out the brass knuckles.
    same i saw that and was like wow.

  17. #42
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    Quote Originally Posted by gallag View Post
    Something is not right with this, There is no way that 1.475v on a non highk process will max out at 53c on air, It just is not possible.



    What temp do you expect deneb to run at with a 1.2ghz oc? Also, I believe water immersion will not help with leakage with high volts on a non highk 45nm process.
    Then again, it might I want this chip out already so we can stop wondering and speculating, it is making me
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  18. #43
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    I have $400 sitting on the shelf in hopes the chip will be out by the time I get home in a few weeks!

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    Quote Originally Posted by m411b View Post
    I have $400 sitting on the shelf in hopes the chip will be out by the time I get home in a few weeks!
    thanks, now your deneb money will now become my deneb money.AHAHAHAHA

  20. #45
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    So what roadmap have AMD released for Deneb speed grades at this stage?

    When is 3.0Ghz due?

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    Quote Originally Posted by Chad Boga View Post
    So what roadmap have AMD released for Deneb speed grades at this stage?

    When is 3.0Ghz due?
    well they released a roadmap awhile back saying the chips would come very late December to early January. now it seems it could be this month and they would be releasing a 2.8 ghz 125W and a 3.0 ghz 125W both for am2+. early next year the am3 ones will be rolling in including a 2.8ghz 95W and a 3.0ghz 125W. thats all i can remember i know they have other chips lined up but they info for them is not released.

  22. #47
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    Quote Originally Posted by hary View Post
    Cpu-z says 1.168v
    ~ typo on my part.

    1.68 would be nuts haha. L2 or Water, and maybe not even water.
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  23. #48
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    Quote Originally Posted by Mattskees View Post
    ~ typo on my part.

    1.68 would be nuts haha. L2 or Water, and maybe not even water.
    Shoot I have my q6600 under water (don't shoot me) and I refuse to put more than 1.5v through it. I can't even begin to think about putting 1.6+ through a 45nm chip
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  24. #49
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    I have no qualms about putting 1.6 through a chip

  25. #50
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    My guess it'll hit 3.6-3.8ghz on air, around the same IPC as Yorkfield and perform similar to Yorkfields when both are oc'd to the max (on air).

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