Haha I see the sig got changed.
I'm still in awe that AMD somehow crammed 2.5x ALU's, 2.5x TMU's, redid the internal chip communication, distributed L2 caches, beefed up the ROPS/RBES in just 30% more die space...
Haha I see the sig got changed.
I'm still in awe that AMD somehow crammed 2.5x ALU's, 2.5x TMU's, redid the internal chip communication, distributed L2 caches, beefed up the ROPS/RBES in just 30% more die space...
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