Real world performance of these chips hasn’t got anything to do with the subject of how much do you harvest them from the wafer…Only thing that’s publicly available about TSMC’s nex-gen manufacturing process is that they are very satisfied with the progress and are even so confident in the quality that they dare to compare it with Intel’s High-K process.For 45nm, they still developed and use 45nm for LP. But as they wrote, 45nm dont hold enough benefits so they go for 40nm. Yet more waitingtime.
If anything its just a show of things aint going as they should.
http://www.beyond3d.com/content/news/636






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