Possible crude mounting test would be first test horizontal then rotate the board to vertical and see if your temps change. Heat pipe performance might be affected although water and stock type sinks I think would be OK.Originally Posted by Bail_w
It is very tough to spread the IC diamond TIM, i mean tough.btw, all my mounts were horizontal.
What's awkward about this kind of testing is the minutia that emerges when trying to parse the last couple of degrees.
On OC tests the average of 45 or so ended up to be 2.8-2.9 C - Subjectively a well motivated group
Hardwarelogic with the emphasis (I assume) on the "pea" averages increased to 3.7-3.8C - A highly motivated group
Anandtech is in process with "pea" emphasis with only 8 people reporting so far ( I like 20+ for the averaging) is at 2.5C. - Highly motivated group, one user was experimenting spreading the paste with a vibrator
AmdZone which is just about finished come in at around 2.3 C with low enthusiasm, low response rate - Most on those that signed on for a free sample it was their first and sometimes their last post on the forum which is why my focus changed to the more stable, experienced dedicated Distributed computing forums.
You have to assume that different "island" community forums will have some different mixes of before compounds and equipment That will move the averages a couple of 10th's of a degree one way or another.
I would like to get the averages up a bit overall, which should be doable.The devil is the detail.
The break in or cure time I do not have nailed and I would like to be able to say something like "2 hours to 2 days depending on sink pressure" or whatever it works out to be. so some attention here would be appreciated. Thanks everybody
Reply With Quote
Bookmarks