Brahmzy,
I'm not sure but isn't Asus P5E series mobo's HSF heat epoxied with X38's IHS (NB chip)? They should be glued together and hard like concrete when cool, are you sure they do not 100% contact with each other in your board?
While for the HSF of ICH9(SB chip), I believe it's worth a double check as there is only heatpad used.
BR
Last edited by TKC; 12-10-2007 at 06:59 AM.
Mobo: Asus P5E 1.03g - RF 0403
CPU: Q6600 G0 L723B837 @472x8=3776 (Vcore bios=1.5875, CPUZ 1.44 idle=1.520/load=1.472)
RAM: Transcend aXeRam DDR2-1066+ CL5 2Gx4 @1133 5-5-5-20 2.36v
Video: MSI NX8800GTS OC 320M
Cooling: Enzotech SCW-1/SNBW-SLI/TT CL-0088/HNP-EX2D Radiator 4x12cmFan/GBT PUMP+Tank
PSU: Seasonic S12+ 550W
Case: LianLi PC-A70B
OS: Vista HP x64
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