Quote Originally Posted by DMight View Post
#1 - I'm on my 2nd board. The first one I could not remove the HS at all, I simply got too nervous with the amount of force it seemed was necessary to remove it. With my second board, it popped right off with minimal force using my hand. It has been suggested a number of times that it's necessary to attempt removing the HS before starting the board so that the thermal adhesive isn't able to set. That being said, I wonder if it's possible that certain boards are exposed to ambient temperatures, whether in shipment or storage, which heat the compound enough to make it more difficult to remove. Or, is Asus doing something different with more recent board revisions. My first was an SE rev.1.02G. My second is a non-SE rev.1.03G.

#2 - I'm using an 8-pin 12V connector.
Thanks for the heads up. This sucks, I hope this thermal epoxy paste keeps temps down as good as AS5. Does anyone know if their is much of a benefit using AS5 vs this epoxy thermal compound?