Hey guys, just wanted to say thanks for all the great info posted. I've been lurking here since the 2nd page of this thread.I purchased the board about a week after. It just sat while I was waiting for parts. I still don't have everything I want but a leak in the Asus Deluxe build forced a tear down. I decided to do a temp build with the Maximus just to make sure everything worked before redoing the W/C. This thread has reminded me sooo much of the ICFX3200 T2R/G board's thread.
So many problems and unhappy people.
Fortunately despite using 4GB of Ballistix 8500 things went well for the most part. I had no luck with raid 0 and XP x64 despite the latest drivers. Vista 64 installed Raid 0 without a hitch. The failure rate of the Ballistix ram is troubling and I can't help but think people aren't paying attention to the overvolting of the ram. I set the bios for 2.0 and got 2.1 in Everest and 2.3 in AI suite.
I backed down to 1.9 and now Everest reads 2.0 and AI 2.05. This is running stock 1066 speed. It's been folding stable for a week. My NB was running 45C despite chilly 65F ambients so I decided to reseat the NB and SB. Whoa! They used mega amounts of adhesive. NB was completely covered and SB almost.It took at least 30 minutes and felt like 45 to remove the block and HS with extreme care. Check out the pix. With 4 screws and a back plate why on earth did they feel adhesive was necessary???? I probably won't have this rig back up with my W/C and be ready to OC till next weekend. By then maybe bios 902 will be up.
And I won't have my 3870s in crossfire till about the 12th.
Edit: I have an active ram cooler coming for the Ballistix. Even on the my Asus deluxe they could burn you running at the rated 2.2v. That ain't right.
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