Really nice
How do you get the Cu and Al "glued" together?
Really nice
How do you get the Cu and Al "glued" together?
Awesome containers. Large inside volume should make overclocking bit more confortable. Pictures from inside? I dont think that many are able to follow that machining work anyways![]()
"I would never want to be a member of a group whose symbol was a guy nailed to two pieces of wood."
Bravo k|ngp|n, same question like others any pics of internals?
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BTW How much does it weight?
Born to overclock
saw a shot of the new gear the other day DROOOOOL
but was wondering how the hell ya gonna fit 3 of these and insulation LOL ....it's gonna bit tight![]()
Lol my thoughts are confirmed now
It was the only and perhaps most effective way to improve, and you did it with style![]()
nice one, btw take a pattent on this one![]()
Looks nice, and expensive![]()
Competition ranking;
2005; Netbyte, Karise/Denmark #1 @ PiFast
2008; AOCM II, Minfeld/Germany #2 @ 01SE/AM3/8M (w. Oliver)
2009; AMD-OC, Viborg/Denmark #2 @ max freq Gigabyte TweaKING, Paris/France #4 @ 32M/01SE (w. Vanovich)
2010: Gigabyte P55, Hamburg/Germany #6 @ wprime 1024/SPI 1M (w. THC) AOCM III, Minfeld/Germany #6 @ 01SE/AM3/1M/8M (w. NeoForce)
Spectating;
2010; GOOC 2010 Many thanks to Gigabyte!
woah nice new design K|NGP|N, last pic. mounted on 8800 cards for sli on
striker says it all.....should be fun![]()
now this is just hardcore!
Buildin
Thank you. Yes it makes it alot more comfortable with both DI and LN2.
Some examples of that are when ULTRA cores are at 1000mhz/1.65v for nature in 01 for instance when the previous tek9 containers are pulled down to load temps, the old units required to be filled maybe 2-3 times during game test, but thats how they were designed. They worked the best when nearly filled to the top due to the massive front wall I used on them. That is where the majority of the "pull down" force came from. You really had to use the whole shaft of the unit for your best heat exchange at high load because of size limitations front to back and every square inch of the unit or "potential unit space". Thats why I left it so square and blocky and didnt want to wreck the unit by putting fancy corners on it.
A cool thing with those old units was that the internal volume was so small and max ammount of LN2 they could take was so limited, that it was nearly impossible to overpour them when benching. Never took long for the container to boil off a full pour under load, so with the right timing and knowing the units/HW well, you could run the cards at nearly any temp/any load and still holding within a few degrees going from extreme load to no load.
Now these units are different than old in terms of timing of pours with Ln2. It took some getting used to as I know the old ones so well, but now when I go back to the old ones after using these it's crystal clear. Where the old units needed maybe three hammerings during nature at 1000mhz core, this one might need only big one at beginning and it will hold well througout the test...still pulling down, but at a much slower rate. I ran an ultra last week for full 06's on one of the new ones at close to 1000mhz/1.62v using no colder than -80c on the unit.
That was really the main thing I think with previous units is that the space was so limited the cards they did good with LN2, but the DI performance was lacking and a GPU unit needs to be able to do both, more so than cpu unit. You have to have the ability to run DI really good on gpu's as it is so nice to leave the cards on DI if the unit is awsome DI unit it can do alot of damage using DI.
Using foam shims. They would wobble if I wasnt using them for sure.
Speaking of the shims/pads, I use them when I insulate the unit. Solarfall mentioned insulating a few posts back and it couldnt be easier with this unit using a foam wrap. I'll get to that soon.
More pics, this time ATI/X-FIRE stuff for dual spacing. Same deal mounting as ultra, just use inside holes on bracket for perfect fit and there are two mounting options here as well. Though the thumbnuts will fit between the cards, the thru back of card way makes Xfire mounting much more easy and allows for plenty insulation:
Screw heads not reallying sticking up farther than smd's on card using thru-back card. Helpful for X-fire dual spacing:
Here is one for the ATI ballers... 2900's on blitz3 with F1:
Of course I couldnt resist doing this:
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Last edited by k|ngp|n; 10-07-2007 at 07:03 AM.
I loved!!! CF of 2900.. really nice..... congratulation vince
iMac 24''
BNDMOD @ Cruz Alta (Cba.) Argentina
"You really had to use the whole shaft of the unit for your best heat exchange at high load because of size limitations front to back and every square inch of the unit"
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lol...
KP... dude, check ur PM!
These are awesome again! "toast:
Funny thing no-one has ever though about making them wider. Now you did, it seems so obvious.
Have a nice day![]()
QX9650 ES - 1M @7,984 sec - Asus Maximus Formula SE - LN2
E6600 - 1M @9,937 sec - Asus Maximus Formula SE - LN2
E6600 - 1M @10,016 sec - LN2
E6600 @ 4100mhz AIR -1M 12,500sec
E6600 @ 4285mhz AIR validation
OCZ PC8000 @ 684mhz 5-5-5-15 1M
http://www.overklokken.info --> THE dutch overclocking website.
Damn......Looks so nice.![]()
Vince must practice taking pics, not overclocking.![]()
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Last edited by AndreYang; 10-07-2007 at 11:22 AM.
What a beautiful design Vince. I love the Tek-9's I have, these must be even nicer to bench with the extra capacity. You've taken cooling to another level with this & the F1, damn nice job man![]()
maybe it was harder to make them this way??? or more expensive??
but piotres did some half tube cuts and basically had the spacing for single slot design >>> but this design is so much superior with a lot of mass
would be nice to see the gangsta internals tooand see how this design gets rid of the LN2 "whirl effect" which plagues most current pots atm
I'll show internals soon. I have no idea about the "whirl effect" as I have never seen that happen with my pots ever, but think I know where you got that from.
When I hear the term whirl effect, I think of the scene in Dragons Lair where dirk is paddling through the purple/green rapids lol.
Got 1030mhz stable 1.59v/-85c on a new EVGA ultra. Container can hold within a degree or two through Nature at these clocks if I get THE pour just right at beginning. It's also gt2/gt5 stable 06 at these settings so pretty strong card at this voltage. Shader clock has more headroom too. Testing only card clocks on the unit:
Putting together a step by step for probe inst/insulating for the unit. Very fast, very easy. These units will come with probe holes pre-drilled.
Last edited by k|ngp|n; 10-07-2007 at 06:19 PM.
Nohing of the sort observed on some of Vince's (really) old units on 2900XT and I got witnesses.Even some of his older Tek 9's were owning their heat output, can't wait to see how much ass these kick.
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Nice Vince. It reminds me of some of those pots done by the guys over in Asia back when we were all running DFI NF4 SLI-DR. They took a bunch of copper plates and made them into a rectangle brazed together for single spacing.
http://holicho.lib.net/top/020912/020912_02.jpg similar to that but smaller.
I was thinking of taking my current pots and just cutting them down the middle and putting a new back on them but your idea is so much better.
Originally Posted by 3oh6
Originally Posted by Brian y.
very nice, can't wait to see the single slot design
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