The process isn't new, nor are low yields a function of all new processes. (Think non-AMD processes here.)
The problem is a function of the very large monolithic die together with a seemingly mediocre defect density (so large numbers of parts have at least 1 completely defective core) and what seems to be a lot of small scale variation in AMD's 65nm process (meaning that neighboring cores, even on the same die, are sometimes (often?) quite different from each other in terms of speed and power bin, which creates a huge binning problem for QC parts, as the lowest bin core "wins", and any high-leakage cores drive up the overall TDP).




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