Official GIGA P35-S3/DS3/DS3R/DS3P/DS4/DQ6 bios/info thread

[superray]

Well last night I decided to remove all the copper heatsinks off my DQ6 and was shocked to see that the contact points where .
The P35 chip had decent contact but the TIM was rock hard. There was only 1 impression in the heatsink pad for the MOSFET modules around the CPU.

I had applied Artic TIM and also used some heat resistant o-rings on the nuts for the north bridge to add additional pressure. I felt there was too much movement for the block on the northbridge.
Normally I could put my finger on the heatsink and not feel much heat, now when I do this the heatsink is warm.

The standard TIM pads that are shipped with the motherboard obviously do not do what they are meant to do.

Same thing here with my DS3P
The thermal pad was rock solid
I took it off and used AS5 on NB, but it seems no big improvement on the temp, and the heatsink is not very tight now.

[zsamz_]

Same thing here with my DS3P
The thermal pad was rock solid
I took it off and used AS5 on NB, but it seems no big improvement on the temp, and the heatsink is not very tight now.

i replaced the springs heatsinks are verry tight