Well last night I decided to remove all the copper heatsinks off my DQ6 and was shocked to see that the contact points where .
The P35 chip had decent contact but the TIM was rock hard. There was only 1 impression in the heatsink pad for the MOSFET modules around the CPU.

I had applied Artic TIM and also used some heat resistant o-rings on the nuts for the north bridge to add additional pressure. I felt there was too much movement for the block on the northbridge.
Normally I could put my finger on the heatsink and not feel much heat, now when I do this the heatsink is warm.

The standard TIM pads that are shipped with the motherboard obviously do not do what they are meant to do.