Quote Originally Posted by tastyratz View Post
The tape idea seems good, but the only thing that concerns me is conductivity and residual electricity in the chip (if any?) I mean remote possibility but its something.

Lapping should even out temps because your creating an even contact surface for cooling. Because theres 4 cores in different locations you may then see cooling differences based on heatsink/waterblock design. If 1 of the cores was in a bowed location then it will be reflected in its temps.

Also you must remember that the contact between the core and underside of IHS may not be good. I've seen that a few times. If you lap it perfectly straight and still have big fluctuations, it's probably the core/IHS contact, not IHS/HSF/Waterblock contact.