how about creating a C clip that attaches to the middle of the water block and on the same position at the rear of the board??? that would give you all the pressure you need exactly on the middle.

Its sort of like the athlon xp cpus that had no IHS. If you put the "spring" mount the wrong position it would not excerpt the force on the middle of the die but somewhere else and you would loose 3-4C. Maybe that is one of the reasons that the TT kit being so bad in its parts had decent cooling. That H type of affixing itself to the board is very very good.