This thread is really kind of funny ...

So here is a bit more insight: The WayCool technology has been licensed from OnScreen Technologies and we have built more than 50 prototypes over the last year for all kinds of application. This said, copper is reaching its limitations of thermal transfer capability with modern CPUs that run lower power than earlier generations but also have much reduced die area -- therefore higher area power densities than anything before. ... that is up to 200 W/cm2 under normal conditions and way more in overclocked systems.

The only materials that can handle that type of thermals are based on directional graphite, which is the material used in this water block. The design is proprietary and patent pending so I won't comment further.

The second key of the cooler design is the microchannel array contained in each of the heat exchangers. We have achieved designs of less than 1 mm thickness with approximately 80% of the structure being interleaved micro-channels that result in almost complete isothermicity across the entire cooling surface within fractions of a second.

The cooling fluid is moved through a pump - whichever design fits the application, regardless of whether it is a positive displacement, rotary or centrifugal pump or even ion charge pump for smaller units.

The combination of a very high thermal exchange with the heat source with an extremely efficient heat dissipation device that only needs very slow air movement is what this is all about. We built completely passive solutions for graphics cards already that even in a 1 slot form factor beat the crap out of dual slot fan solutions and those will hit the market also in the near future.

The pump and fan are driven by the same motor that can be completely immersed in the coolant - which in that case can also act as noise suppressor for the bearings and as lubricant, similar to dynamic fluid bearings in HDDs.

Since I have spent overall about 3 years in the R&D leading to this prototype, I know very well what it can do and what not and whatever is made public about the technology will hold up.

Regards,

Michael