I have a liquid freezer II 280mm on my 3800x. The heat from rad is non existent yet the chip still hits 84c ( prime 95 ). That tells me that the die is not transferring the heat well to IHS into water block. I don't think it's an interface issue either as it's been proven that delidding gains almost nothing. I just think it's a surface area issue. The die is small its a concentrated amount of heat on a very small portion of IHS. A larger die would transfer heat better. With the 3900x however the heat transfers more and the exhaust out of radiator is warm. It's got double the dies pumping heat into IHS.





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