Quote Originally Posted by graysky View Post
Is that right? Draw a pic of the thing... Seems like if you remove some buffer material, the die is a fixed distance off the PCB and the inside of the IHS is also a fixed distance, so by removing the intel black sealant of height x we are effectively lowering the internal clearance between the die and the IHS by that same distance. Am I thinking about this right?

Link to full size:


EDIT: http://forums.anandtech.com/showpost...1&postcount=31

Thank you, that's an excellent photo. It doesn't look like regular runny TIM, it seems more like hard, crumbled ceramic.