It´s important to note that i have spoken of thermal issues only in relation to use of a very strong test as Linpack. My cpu and mobo temperatures are good, even by air. But, as i´m experiencing, the key is the union of heat stress plus electrical stress. I think that is not important 10 degrees at 3.8Ghz, 180 bclk, full load Prime, but maybe only 3 degrees at 4.0Ghz, 211 bclk (my settings), full load Linpack. Comes to my mind the word "electric fatigue" or, better, "PCB fatigue".It's also difficult for me to believe my temps are holding me back, which are topping 55-60c, when i see people here topping 70-80c regularly, and 90c+ without fatal issues.
The key is that with Linpack we can achieve very quickly (generally) a system full Prime95 stable. But is not so fast to reach a system Linpack stable (although this is faster than achieving a stable prime95 system using only prime95). The problem is compounded if Linpack from a certain OC level begins to introduce abnormal errors due to its enormous and abnormal power.Compared to prime, pretty much everyone, on the posts i was reading, on this forum and others. If you google you'll find many posts stating between 5 and 20 runs as commonly used to verify complete stability. Like i said yesterday (or the day before maybe) the reason i switched to it was because prime started causing crashes after huge periods of time, and i was after a quicker way to test. Linpack was a much quicker way to test, by popular opinion anyway. If i'm going to have to run even that for 6-8hr+ to get reliable results, i'll stick to what i know (prime)
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