Quote Originally Posted by Apokalipse View Post
umm, the lower heat dissipation would be because it's clocked lower, and probably less voltage....
They'll be lower binned aswell....
The relationship between frequency and power is P=C*V^2*F, Fmax (max frequency) is related to the quality of the silicon as the inherent variability in each step toward making the CPU will cause subtle differences wafer to wafer or die to die.

As a result, Intel and AMD bin the CPUs based on various voltage, fequency max, and other criteria. But the general power relationship will always hold. If a CPU is not meeting the stability, error rate standards at 3.0 GHz but does at 2.8 GHz, then it bins there... the power naturally will come out lower overall.

Depending on the Vcc and fequency, that total power can fall within a certain power envelop. So TDP ratings are power bins, just like frequency bins ... within the TDP bin different processors will produce different thermals, but to get within that bin they simply need to be at or less a certain power mark (i.e. TDP minus an engineering margin of error).