Innovation Cooling Diamond 7 Thermal Compound

[Nate P.]

IC Diamond 7 Carat Thermal Compound maximizes thermal heat transfer between the CPU core and heatsink by taking advantage of diamond's superior thermal conductivity.
Purified synthetic diamond has a thermal conductivity of 2,000-2,500 W/mK compared to 406-429 W/mK for pure silver.

Diamond's five times better thermal conductivity compared to silver makes it a superior heat transfer material for cooling high performance CPUs and is electrically non-conductive and non-capacitive.
Key Features

* Each tube of IC Diamond Thermal grease contains 7 carats of micronized diamond with diamond particle loadings @ 94% by weight. Material loading above 90% is recommended as the best combination of rheological and thermal properties to minimize interface pump out due to thermal cycling.
* Superior bulk conductivity
* Excellent thermal impedance
* Tight particle distributions
* < 40 &#181; maximum particle diameter
* Silicone free
* Lower viscosity
* Greater stability
* Non capacitive or electrically conductive

The thermal spread was pretty good with my old AS5.



Pea sized dollop. Maybe a little excessive?



Temperature results (at 60F/15C ambient):

AS5:
* Idle: 17C
* Load: 30C

IC Diamond 7:
* Idle: 16C
* Load: 28C

A few degrees better than AS5! I think I'll stick with ICD7 from now on, and the fact that it's non-conductive just is icing on the cake.