Currently testing E7200 chip with Q751A473 FPO.

This chip has the lowest VID I have seen so far, 0.95V

The biggest problem with E7200 chips seem to be the physical size of the die.

The surface area of M0 stepping die is only 82mm˛ because of the fact that there is only 3072KB of L2 cache. The surface area of C0 stepping die is ~ 32% (82mm˛ vs 107mm˛) larger so the heat will transfer better from the die to the heatspreader.

The heatspreader of M0 stepping chips is not glued to the die so it can be removed quite easily. The difference in die temperature (by CoreTemp 0.99...) was nothing less but 18c - 20c lower without the heatspreader.

In both cases Thermalright Ultra 120 Extreme (lapped) heatsink was used and the frequency and voltage settings were the same (4GHz, 1.33V).

Using Prime95 with 10K - 14K FFT lenght seem to give the highest die temperature and maximum unstability with M0 stepping chips.



The chip is currently running at 4.2GHz with 1.39V.