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Thread: AMD Stepping Information Decoded

  1. #1
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    AMD Stepping Information Decoded

    s7e9h3n and I have been working on decoding the AMD memory controller/stepping information found on all new AMD processors for awhile now. This information is the combination of 5 letters and numbers found on the second line, immediately proceeding the year/week production code.

    Example: CABNE

    1st letter: "production/release code"
    Pre-production or early samples have an "A" here where final production batches will be a "C" (for current chips). Some may recall that Venice samples where seen in the wild as "ABBLE" and current production runs are "LBBLE". While complete understanding of this is unknown at this time, it is clear that this has something to do with early samples.

    2nd letter: "core cache code"
    A = single core, 1MB
    B = single core, 512KB
    C = dual core, 1MB (each)
    D = dual core, 512MB (each)

    Note: 'Toledo' cores (1MB) with half the cache disabled will still be coded as "C". Therefore, you can see earlie 4600+ samples as ACXXX with only 512KB per core enabled.

    3rd and 4th letters/numbers: "memory controller revision"
    Works like a counter using all letter of the alphabet and digits 1-9. 3rd letter increments when running though all available 'steppings' as noted by the 4th letter.

    FX-55: XXA2X
    FX-57: XXBNX
    FX-57 (new stepping)/FX-60: XXB2X
    3700+ (new stepping): XXB3X
    ...
    and so on...

    5th letter: "revision code"
    C = rev C (as in CG Clawhammers)
    D = rev D (as in D0 for CBBID chips....)
    E = rev E (as in the rev E 'San Diego' core)

    -FCG & s7e9h3n

  2. #2
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    Nice find m8!

  3. #3
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    What about "K" as in KAB3E
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  4. #4
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    nice research guys.

    as for Venice, i've also seen a YBBLE.
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  5. #5
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    hi, do you have information about the four last letters of the stepping:

    like 0540 APMW

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    starostise,
    Those 4 last letters are explained on the las page of this doc.
    You were not supposed to see this.

  7. #7
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    Quote Originally Posted by starostise
    hi, do you have information about the four last letters of the stepping:

    like 0540 APMW
    that was discussed on several occasions... but nevermind, here you go:



    EDIT: largon was a bit quicker.
    Last edited by high5; 07-19-2006 at 01:59 PM.
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  8. #8
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    Well, obviously only 3rd and 4th letters are useful
    ...

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    Then we have the last row. That one isn't an easy one to decode...
    My silicon gallery includes:

    146 Venus':
    1st:
    1347827J50199
    2nd:
    1347827J50265
    3rd:
    1347827J50280

    3000+ Winnie:
    1197499B50126

    AXP-M 2600+ Barton:
    T873301G40109

    AXP 2800+ Barton:
    T866652F40227

    The last 4-numbers can't be the core's serial number limited to a single wafer because Venices come with a batch nº as high as ~2400 and there are about 600 cores on one wafer.
    You were not supposed to see this.

  10. #10
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    Eh...according to that, there shouldn't be "MW" endings either. My ancient Claw and my Opty 146's have MW endings. Or are fab lots and wafer lots simply different things entirely?

  11. #11
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    good point Jimi.

    my Sempron is also EPMW, LBBWE 0531.
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    CABQE

    C > final production batches will be a "C" (for current chips)
    A > A = single core, 1MB
    BQ > new stepping
    E > rev E (Revision Code)

    0547

    05 > The last 2 digits of the year in which the product was seal/molded
    47 > Work week in which the product was seal/molded

    GPAW

    G > Alpha/numeric character for the day of the week during which the product was seal/molded.
    P > Alpha/numeric character for the assembly location
    A > Alpha/numeric character for the wafer lot seaquence for the day.
    W > On rare occasions, a "w" may be added to the DC to designate that combining wafer lots is prohibited.
    right ?

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    LOL...My dog woke me up since he had to go pee. Decided to drop by and see what's going on....There needs to be a couple of fixes in the original post. I guess I did proof-read it too well before I said it was OK to post This is what I see atm that needs revision:

    1) The sample venices were mainly CBBLE, not ABBLE. The ones I debuted at XS were both CBBLE. The letter seems to refer to the a particular production run for that specific cpu. It has little/nothing to do with the memory controller itself.



    2) There were no early 4600+ samples with the "C" code. FCG had one marked that way, but I have a feeling that there are very few, if at all any 4600+ Toledo Cores floating around. My 4600+'s, which are the earliest documented X2's, are both TRUE manchester cores with the "D" notation. The prime examples of the "C" 512K l2 x2's are the recent 3800+'s - many with the stepping CCBWE.

    This cpu, was quite simply one of the strongest dual cores ever created, and that includes all the FX-60's. It's the WR holder for a dual core at 3.65Ghz @ 1.65Vcore and was run daily on OPB's single stage at 3.5Ghz @ 1.5Vcore. In addition, it's the first (and only AFAIK) cpu to score over 10K on PCMark04 and to this day still sits atop the Orb. Btw, on a stock mach2, I was able to get it to ~3.3Ghz @ 1.4Vcore. But what was most impressive about the cpu was the fact that @ -110C evap temps, if functioned just as well as it did @ +30C...........Which leads me to my next point about how this new-found information can be useful for spotting a cpu which *possibly* has better properties under the cold than others.........
    Till now, it was common belief that cpu's which were cold bugged/non-cold bugged could be identified by it's ENTIRE stepping (meaning the first five letters of the second line), but if this theory holds true, all one has to look at is the 3rd and 4th characters of those letters/numbers. If you notice above, the 3rd and 4th characters of the 4600+ are "BH". Here's what temperature the little brother of OPB's cpu (exact same stepping) is able to function @:

    Yes, that's -98C CORE temps you see Now I've been told by quite a few reliable sources that my FX55/56 (check my sig) has absolutely no cold bug as well:

    Notice the revision of the memory controller? "BH". I've also confirmed with our fellow forum member GHZ that his 4000+ CABHE (which is F/S in the trading forum) doesn't show signs of the cold-bug as well. The memory controller revision possibly dictates a RANGE of temps that a particular cpu can operate at without worry of HTT problems. Now I haven't gathered enough evidence to say that this is totally foolproof, but from what I gather from both personal experience and evidence contributed by others, this for the most part is true. It seems as the revisions of AMD's memory controller have evolved, the less tolerant to cold they have become, e.g. CAB2E, CCB2E, KAB3E. Of note: The fact that a cpu doesn't have a cold-bug doesn't mean that it has limitless potential for OC. That seems to weigh on the quality of silicon which the cpu is built upon. Also, it seems that cpu's generally with lower batch numbers show less symptoms of the bug that the higher-numbered ones. There may be other factors which play into how a cpu is cold-bugged, but those are still unknown and haven't been identified as of yet.......

    OK, I'm about to fall asleep at my keyboard after writing this so I'll continue in a bit after I get a couple of more hours of sleep

  14. #14
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    Well, well BH-rev memctrl?

    AMD techs have clearly been visiting Winbond fabs, no?
    You were not supposed to see this.

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    Quote Originally Posted by brechtvm
    right ?
    The "C" doesn't represent "Current chips", but rather a certain production cycle of the cpu. I'm not too sure how they're related, but I believe "K" and "L" share some sort of similarity as they are both more mature cycles of the older "C" cpu's. "Y" is one which I have no idea on FWIW, I have had a few Opteron ES cpu's which begin with the letter "F":

    These cpu's never ended up making it to production in their current package. Instead they were released as Opteron 275's.

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    Nice decoding
    Guess all our CABGE's just got a little better, eh?
    But then again, they would prolly need massive temps to outperform good CABNE and CABYE's..

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    @ s7e9h3n : Thx !

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  18. #18
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    Quote Originally Posted by largon
    Well, well BH-rev memctrl?

    AMD techs have clearly been visiting Winbond fabs, no?

    Give the CPU 3.6v and find out
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    So "CJ" is a late late mem controller revision which might explain why it is so cold bugged. Well, Coroner Kyle's FX-60 is "B2" and it's 0548... there's hope for us all yet.

    Thanks for the insights, s7e9h3n.

  20. #20
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    Good job guys...Now the million dollar question is what FX60 stepping is least likely to be coldbugged or will handle the cold better?

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    Wow this is some really good info, Wonder if we could get a list of all the mem controll revisions for the 90nm chips and start comparing cold bug data. If we can establish a good correlation between the different revisions we can possibly show people with subzero cooling how to better their chances of getting a cold loving chip. GREAT WORK!
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  22. #22
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    This is a great discovery, i have to spend a lot of time thinking about it.
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  23. #23
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    hmmm, yes.. i smell a new database coming on

    crash, i'm gonna venture CCBHE
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  24. #24
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    Hmm I need a BH dual core then... and it better not bug
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  25. #25
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    hmm my X2 3800+ is CDBHE, just needs its pin fixed ><
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