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Thread: 3 differnt types of UTT!?!?!

  1. #1
    Xtreme Addict
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    Exclamation 3 differnt types of UTT!?!?!

    Anyone know wtf is going on? First it was obvious that UTT was using former Winbond casings which had 2 dots. But now you can find UTT with 1 dot, 2 dots and even no dots....all of it is the same ICs

    Anyone care to explain wtf is going on?

    Example:

    http://www.ocforums.com/showpost.php...30&postcount=4
    NZXT Tempest | Corsair 1000W
    Creative X-FI Titanium Fatal1ty Pro
    Intel i7 2500K Corsair H100
    PNY GTX 470 SLi (700 / 1400 / 1731 / 950mv)
    Asus P8Z68-V Pro
    Kingston HyperX PC3-10700 (4x4096MB)(9-9-9-28 @ 1600mhz @ 1.5v)

    Heatware: 13-0-0

  2. #2
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    I'm not sure but didn't OCZ admit they use UTT on VX. The IC's on VX don't have the Winbond-dimples (As far as I know).
    You were not supposed to see this.

  3. #3
    I am Xtreme
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    the ocz VX is built to thier specs, so while it uses the UTT die, they cant package it anyway they want, maybe they have it packaged to handle more volts/heat?

    they only company without dimples that ive seen with UTT is OCZ, so i just assume that it is because of thier claim that they are "made to thier specifications"

  4. #4
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    They have probably just milled the top off of the ceramic on the chips. Ceramic doesn't transfer heat well so by removing it the die can be kept a little cooler.
    For those of you about to post:

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