Quote Originally Posted by behrouz View Post
ok , due to Bad Thermal Grease in Ivy Bridge , Is Haswell hot as IV ? did Intel fix it ? Hope Intel gives us good new
the culprit behind the overheating issues of Ivy is not the thermal grease but the black adhesive



Compare all the "a" cases to the "b" cases, the only functional differences in these two test conditions is the CPU TIM. Notice that the Intel stock CPU TIM outperforms the NT-H1 replacement TIM once the CPU-to-IHS gap is identical

(all the "b" cases are ~2-3?C warmer than the "a" cases)

And if we remove the paper shim and drop that IHS down onto the CPU (not perfectly zero of course, there is still some NT-H1 CPU TIM there after all) reducing the gap to as close to zero as possible then we get the "c" cases...and the temperatures show the expected fantastic drops we have all come to expect from delidding our Ivy Bridge chips.

Conclusion: The Intel stock CPU TIM is not the reason Ivy Bridge's run hot, and replacing the Intel stock CPU TIM is not the reason a delidded Ivy Bridge runs so much cooler - the benefits of delidding are entirely due to the resultant reduction in gap height between the CPU silicon die and the underside of the IHS.
the black adhesive glue is too thick making the gap between the die and IHS wider than it should be.

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