I try to be useful here
This behaviour is because you need to have some buffer between pot and die.
I found out, that if you have direct contact between the large copper block (base of GPU pot),
results will get worse especially in heavy load.
When you have this kind of contact, which is actually super good,
you will not be able to transfer heat fast enough out of the die.
This is the reason you will loose that much MHz. It will propably cause the instant lock up in the beginning of some test.
Nvidia stock thermal paste is shin etsu, which is not good paste in general, but not bad with ln2 either.
It is working pretty well in heavy load and it is possible to transfer that huge heatload to HS.
When you have some good thermal paste in use, you will now be able to transfer that heat from HS to GPU pot.
This way the temperature of GPU is higher and when you have enough voltage they will run well.
Without HS you will get too cold very easily and face some other cold related issues as well.
I actually tried quite thick copper plate between pot and GPU HS and it worked well.
That was my 1455MHz unigine run with that certain DCII card.
The card was a lot easier to hold in correct temperature range that way.
So, my point was that keep the HS on. Keep the GPU warm enough and give enough voltage for it.
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