Danish Danamics Bankrupt.

[Nosfer@tu]

OCTDK has through an anonymous source been given access to documents regarding the Bankruptcy declaration and the asset inventory of Danamics, Danamics website is also unavailable.
Customers and other visitors are greeted with a standard advertisement for hosting the software Plesk.

Demands and Claims against Danamics should be sent to the law firm LETT, as they are handling claims against the company

A full report will be sent to creditors no later than the 15 of January 2011.

Read more : Google Translate link
http://www.octeamdenmark.com/nyheder...t-konkurs.html

[BeepBeep2]

Ouch.

They had good coolers, but the concept and marketing failed. They were unobtainable here in the US.

[marten_larsson]

Not that unexpected seeing as their products were inferior to much cheaper solutions.

[Russian]

Oh well, they sounded cool but they were overly expensive. They needed to invest more money in solutions other than just CPU coolers.

[Calmatory]

Not that unexpected seeing as their products were inferior to much cheaper solutions.

This. Well, at least they tried something new... which however made no sense.

They would've needed to stop being stupid and do like everyone else did; use heatpipes.

[cegras]

RIP

In memoranum,

Advanced Pioneered Technologies

The consumer wasn't ready for it yet.

[Nikolasz]

You know drill, whats is made in china thats cheap, good and best for money can buy.
Simple hw made in china is good for rest of world

Recently i get 600 euros radio scanner called yaesu vr-5000 made in japan, quality is awesome no china man can made that complex radio. Maybe copy it, ect...

[jmke]

We have a pending review of the LMX which has run a little late due to test platform changes, the liquid metal cooler works, but not as well as heatpipes and at a higher price point... resulting in a price/performance ratio which makes it a hard sell;
we didn't do dBA readings yet, but CPU temp results using Core i7 inside a well ventilated case, with same high performance fan, one of the high end HSF vs the LMX:


the +0.x in the chart refers to vcore increase

for a higher price point it has to outperform cheaper products, not match them imho.

[Nosfer@tu]

We have a pending review of the LMX which has run a little late due to test platform changes, the liquid metal cooler works, but not as well as heatpipes and at a higher price point... resulting in a price/performance ratio which makes it a hard sell;
we didn't do dBA readings yet, but CPU temp results using Core i7 inside a well ventilated case, with same high performance fan, one of the high end HSF vs the LMX:

the +0.x in the chart refers to vcore increase

for a higher price point it has to outperform cheaper products, not match them imho.

Nothing new in that conlusion m8

Same thing that has been said and proven over and over again the last 2 years

[jmke]

didn't say I'd bring anything new to the table, m8

[BulldogPO]

Was´nt big surprise.

[Baron_Davis]

They failed cause Jesus hates T-1000.

[bamtan2]

heat pipes are amazing. only god can beat that tech. danamics couldnt

[jmke]

heatpipes unfortunately have run their course... not much more performance to squeeze out of them, let's just say that it worked out nicely CPU makers started focusing on power usage; bringing the numbers down certainly helped prevent a burndown, I've tested a Pentium Prescott Dual Core overclocked to 4ghz with a bit of extra vcore... not a pretty sight, if they stayed that course, the current crop of "top" heatpipe HSF would not have stood a chance;

you only have "so" much contact space with the CPU IHS, and now with 6-8 heatpipes that space is full, end of story and development, they can play around with the fin arrangement, but the design of the base has pretty much the same each and every time, but different manufacturers... so we reached a limit. Air cooling can only bring us so far, and while heatpipes are effective for <130W TDP CPUs, overclocking them and expecting superduper performance at low noise levels is just not going to happen.

[halfwaythere]

Oh not with the Prescott stories again.

The way you're coming up with make believe numbers amazes me everytime. I guess according to you a heatsink could never handle an overclocked and over volted i7 at 1.5+v.

http://forum.lab501.ro/attachment.ph...1&d=1282856629

[zalbard]

Ouch.

They had good coolers, but the concept and marketing failed. They were unobtainable here in the US.

I was wondering if they made it to retail at all... The idea isn't bad, though. Some other company should've bought them.

[bamtan2]

heatpipes unfortunately have run their course... not much more performance to squeeze out of them, let's just say that it worked out nicely CPU makers started focusing on power usage; bringing the numbers down certainly helped prevent a burndown, I've tested a Pentium Prescott Dual Core overclocked to 4ghz with a bit of extra vcore... not a pretty sight, if they stayed that course, the current crop of "top" heatpipe HSF would not have stood a chance;

you only have "so" much contact space with the CPU IHS, and now with 6-8 heatpipes that space is full, end of story and development, they can play around with the fin arrangement, but the design of the base has pretty much the same each and every time, but different manufacturers... so we reached a limit. Air cooling can only bring us so far, and while heatpipes are effective for <130W TDP CPUs, overclocking them and expecting superduper performance at low noise levels is just not going to happen.

this is not accurate.

[jmke]

Oh not with the Prescott stories again.

The way you're coming up with make believe numbers amazes me everytime. I guess according to you a heatsink could never handle an overclocked and over volted i7 at 1.5+v.

http://forum.lab501.ro/attachment.ph...1&d=1282856629

attentive reading, not your strong suite.
80°C+ degrees.
and definitely not silent

[Calmatory]

heatpipes unfortunately have run their course... not much more performance to squeeze out of them, let's just say that it worked out nicely CPU makers started focusing on power usage; bringing the numbers down certainly helped prevent a burndown, I've tested a Pentium Prescott Dual Core overclocked to 4ghz with a bit of extra vcore... not a pretty sight, if they stayed that course, the current crop of "top" heatpipe HSF would not have stood a chance;

you only have "so" much contact space with the CPU IHS, and now with 6-8 heatpipes that space is full, end of story and development, they can play around with the fin arrangement, but the design of the base has pretty much the same each and every time, but different manufacturers... so we reached a limit. Air cooling can only bring us so far, and while heatpipes are effective for <130W TDP CPUs, overclocking them and expecting superduper performance at low noise levels is just not going to happen.

1) The "bottleneck" isn't heatpipes, rather the contact between the heatpipes and the base and fins.
2) IHS surface area has nothing to do with it. CPU die<-> IHS surface area is much more important, as the W/mm² is WAY higher. We're talking hundreds of percent.
3) Add more fins -> more surface area -> better cooling.

Clever using of copper, silver and artificial diamond will surely get the price up, but allow lots more potential with the coolers. Understanding basic thermodynamics and thermal physics will help with this stuff.

[Mean Machine]

They were unobtainable here in the US.

That was because the coolers contained NaK, which is deemed unsafe for the public in the US, so they couldn't be sold to consumers legally.

[halfwaythere]

attentive reading, not your strong suite.
80°C+ degrees.
and definitely not silent

Extreme oc-ing and silence don't go well together. And those temps are at 30 degrees ambient.

The way Danamics have failed only confirms that heatpipes are unbeatable in air cooling. The next big step is figuring out how to integrate graphite and other materials into the heatpipes.

And if you want silence get an HR-02 and get over it.

[initialised]

If they didn't jump down the throats at anyone who managed to get their hands on a sample and published a little data they might have had more 'free' marketing from reviewers and the enthusiast community therefore had some sales.

[jmke]

1) The "bottleneck" isn't heatpipes, rather the contact between the heatpipes and the base and fins.

each heatpipe has a limit, there are only so many you can add into a heatsink design

2) IHS surface area has nothing to do with it. CPU die<-> IHS surface area is much more important, as the W/mm² is WAY higher. We're talking hundreds of percent.

sure it has partially something to do with it, as the larger the CPU DIE surface area, the more heat can be transferred to the base -> heatpipes -> fins

3) Add more fins -> more surface area -> better cooling.

CPU contact area plays a crucial part, the Scythe Orochi has an extreme amount of surface area, so does the Coolermaster Hyper V10, neither of those excel or come out on top when compared to more compact heatsinks...

Clever using of copper, silver and artificial diamond will surely get the price up, but allow lots more potential with the coolers. Understanding basic thermodynamics and thermal physics will help with this stuff.

if you go back 5 years and see how CPU heatsinks improved performance every 3-6 months, you'll notice that this trend has stopped; now every 3-6 months we get a re-release with a tweaked design which barely manages to outperform the predecessor, or sometimes even can't match the older one.

Extreme oc-ing and silence don't go well together. And those temps are at 30 degrees ambient.

same OC with water cooling setup will allow for better temps at low noise. when servers are shipped with water cooling to deal with the heat http://www.xtremesystems.org/Forums/...d.php?t=260680 I think it's clear heatpipes can only take cooling "so" far.

If they didn't jump down the throats at anyone who managed to get their hands on a sample and published a little data t

how so?

[demonkevy666]

1) The "bottleneck" isn't heatpipes, rather the contact between the heatpipes and the base and fins.
2) IHS surface area has nothing to do with it. CPU die<-> IHS surface area is much more important, as the W/mm² is WAY higher. We're talking hundreds of percent.
3) Add more fins -> more surface area -> better cooling.

Clever using of copper, silver and artificial diamond will surely get the price up, but allow lots more potential with the coolers. Understanding basic thermodynamics and thermal physics will help with this stuff.

I'm betting Ceramics are next.
silicon carbide is actually a ceramic, higher W/mm² then copper and cheaper.

[halfwaythere]

same OC with water cooling setup will allow for better temps at low noise. when servers are shipped with water cooling to deal with the heat http://www.xtremesystems.org/Forums/...d.php?t=260680 I think it's clear heatpipes can only take cooling "so" far.

Show me a watercooling setup that's cheaper than a high end heatsink and performs better? You can't because there isn't one. If you weren't so hung up on ditching heatpipes you'd realize prime is a worst case scenario and benchmarks will never go that high.

Servers have space constraints and if money is no object of course its better to go water.

Danamics failed because they couldn't get anything revolutionary on the market at a decent price.