Bulldozer Die Shot!

[RaV[666]]

Savantu, Ontario was pulled in.Maybe comments on this ? How is it that you only comment on worst possible things about AMD, and even then you only pick worst case scenarios ?
Based on your thought process i could say, sandy bridge will ship somewhere in march (Q1) , will NOT be overclockable AT ALL (hey, i dont have to point out the K series, im still stating facts) ,and IGP will have performance probably around 3 year old AMD IGP`s (picking 6EU parts) ,and oh it has TERRIBLE software support.Basically the image it would present is that sandy will be late, non oc-able, and performance will be sub par.
Jesus, people, at least try being a little bit objective.BTW, the thread is about bulldozer, not Liano.

And where did you get this "summer 2011" figure ? Because H1 ends in summer ? christ.

[savantu]

Pot vs. Kettle?

An Intel *fan* posting non-stop negativity in AMD threads (isn't this against forum rules? ) calling AMD fans too stupid to process information is complaining about personal attacks. I love it.

Huh ? My remarks are pretty civil and I refrain my name calling and other stuff. Strictly following the rules compared to what I get.

So its okay to make negative comments in AMD threads based on pure conjecture, but anyone saying something positive about AMD in an AMD based on hopes for the best is an idiot.

Score one for hypocrisy I guess.

I must be good in conjecture since somehow, AMD proves me right. But somehow, you are hypocrisy-free when even if my prediction was proven right, you portray it as "negative comments". Is this a denial-of-reality syndrome ?
It isn't negative when later things prove you right, it is being objective. i'm still waiting for your friend, god_43 to answer.

Savantu, Ontario was pulled in.Maybe comments on this ?

The whole problem started with GF 32nm process. GF and the IBM club use a gate first approach which is more problematic to control than the gate-last approach used by Intel. Gate-last requires more restrictive design rules, but if you can live with that, it is doable as Intel proved and offers similar performance if not better than gate-first.

When AMD designed Bobcat, they targeted the low power stuff, basically using small die CPUs for low power consumption and not cherry-picked mainstream large die ones.
AMD choose TSMC because they have experience with bulk ( ATI ) and it is probably far cheaper than GF ( who's FABs are underutilized ). Low cost and low price as with the intended markets, TSMC was the better option.

Not unexpectedly, GF hit problems with the 32nm stuff. Since now, AMD depended with Llano on an external partner, they decided to transfer engineering resources from Llano ( since it is delayed anyway by the FAB issues ) to speed up the validation of Bobcat. That's why Bobcat was pulled in. Llano is probably more or less ready ( it taped out in Q1 ) , but waiting for the fab to solve its issues.

How is it that you only comment on worst possible things about AMD, and even then you only pick worst case scenarios ?

How are they worst case when I'm proven right by AMD ?!
Did Llano get a significant delay ? Yet it did. Check.
Did Bobcat turned quite high power compared to Atom ? Yes it did.
Is AMD lacking any close to 1w solution for smartphones ? Yes they do.

Based on your thought process i could say, sandy bridge will ship somewhere in march (Q1) , will NOT be overclockable AT ALL (hey, i dont have to point out the K series, im still stating facts) ,and IGP will have performance probably around 3 year old AMD IGP`s (picking 6EU parts) ,and oh it has TERRIBLE software support.Basically the image it would present is that sandy will be late, non oc-able, and performance will be sub par.
Jesus, people, at least try being a little bit objective.BTW, the thread is about bulldozer, not Liano.

All could very well be true. If you're proven right, you were objective and I was a day dreamer. But if I'm proven right, will you respond in kind ?

And where did you get this "summer 2011" figure ? Because H1 ends in summer ? christ.

AMD lady said it ""Llano will start shipping in the first half or 2011, and products should be available in summer 2011," said Leslie Sobon, vice president of worldwide product marketing at AMD, in an interview with Inside Hardware web-site. "

[Hans de Vries]

The whole problem started with GF 32nm process. GF and the IBM club use a gate first approach which is more problematic to control than the gate-last approach used by Intel. Gate-last requires more restrictive design rules, but if you can live with that, it is doable as Intel proved and offers similar performance if not better than gate-first.

Again, that's basically investor board fud as usual.

Globalfoundries provides measurement data showing that "Gate first"
is working fine, with low Vt variation, low Idsat variation and is showing
healthy Weibull slopes under accelerated degradation tests comparable
to Poly-SION.

http://issuu.com/globalfoundries/doc...owFlipBtn=true


Regards, Hans

[savantu]

Again, that's basically investor board fud as usual.

Globalfoundries provides measurement data showing that "Gate first"
is working fine, with low Vt variation, low Idsat variation and is showing
healthy Weibull slopes under accelerated degradation tests comparable
to Poly-SION.

http://issuu.com/globalfoundries/doc...owFlipBtn=true


Regards, Hans

Of course, the prowess in powerpoint of the IBM FAB alliance is impressive.
Yeah, I'm still waiting since January 2007 for a HKMG process from the IBM alliance.

IBM and partners tip high-k, metal gates
Mark LaPedus
1/27/2007 12:27 AM EST
SAN JOSE, Calif. — IBM Corp. claims that it has developed the long-awaited improvements to transistor technology: high-k dielectrics and metal gates for use in logic chips.

Working with Advanced Micro Devices Inc. and its other development partners, Sony Corp. and Toshiba Corp., IBM has found a way to construct a critical part of the transistor with a new high-k/metal gate material, clearing a path toward chip circuitry that is smaller, faster and more power-efficient than previously possible.

The high-k and metal gate substitutes a new material into a critical portion of the transistor that controls its primary on/off switching function. The material provides superior electrical properties compared to its predecessor, enhancing the transistor's function while also allowing the size of the transistor to be shrunk beyond limits being reached today.

The technology can be incorporated into existing chip manufacturing lines with minimal changes to tooling and processes, making it economically viable.

IBM has inserted the technology into its state-of-the-art semiconductor manufacturing line in East Fishkill, N.Y. and will apply it to products with chip circuits as small as 45-nm starting in 2008.

http://www.eetimes.com/electronics-n...-k-metal-gates

2 years and counting.....