Your english is fine ... better than mine actually.
Hans is the real expert on deconvoluting die shots and sizes. As has been beat to death, the die shot has been altered for good reasons.
However, Hans did make a guess based on the io pads, which appear to have escaped the photoshop treatment:
http://aceshardware.freeforums.org/p...40.html#p14040
performing the same activity I estimated about 300 mm^2 for a 4 module BD -- so he seems about right, again assuming that the right structures were selected for the scaling. This may seem large to some, but for the markets that this chip would target the margins will be very good.






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