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Thread: The Fermi Thread - Part 3

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  1. #11
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    Quote Originally Posted by Dami3n View Post
    Sorry, but use a thermal camera with a card with full cover backplate -> FAIL
    I seriously doubt the inclusion of a backplate would change things that much. They are still metal and will heatup just like the pcb. Yes there is more surface area for the heat to spread to but to go as far as believing the backplate is a game changer... Assuming that those load pictures were taken after an extended heavy load ( an hour + ) that gives the back plate plenty of time to absorb heat and thus reflect it in the pictures.

    Anyways just look at the side of the 480s heatsinks ( which are still plastic casings similar to the 5870s ) It is clear that the shroud gets very very hot ( ie do not touch hot ) They do have vents yes but the 5870 sink also has some vents in the same area ( just fewer of them and they are smaller )

    Again none of this should be a problem in larger cases with decent airflow and assuming you dont let anything touch the cards for extended peroids, all should be well ( ie lose / messy cables )
    Last edited by Chickenfeed; 04-05-2010 at 05:33 PM.
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