One thing that has been confirmed is that the Bulldozer core has been shown to be incredibly resilient during early manufacturing samples, so much so that AMD has told us that it is experimenting using the 28nm bulk silicon process with only small changes to the die. Although AMD has not confirmed that they will use half stepping, they didn’t deny it either.
32 nm SOI with Immersion Lithography
28 nm SOI with Immersion Lithography half node process
One of the first things that AMD confirmed for us was that the upcoming AM3+ will be the last of the pin grid array (PGA) and that all upcoming processor would be land grid array (LGA) more on that later.
The current AM3 Phenom II only use 938 pins, the upcoming Bulldozer and Bobcat cores will use all 941 pins. One of the benifiets of the AM3+ is that all AMD chips will be able to use DDR3 1866 (PC3 -15000) for staggering 60000MB/s as well as having advanced powersavings.
Going forward AMD’s will implement AMD’s Future socket or AMD’s Fusion socket, (Socket AF1) a massive Socket 1591 pins sock that will be the first of AMD’s next generation sock supporting DisplayPort 1.2, Full PCI Express 3.0 32 lane, and the
addition of two more DDR channels allowing for quad channel memory.
Reply With Quote
Bookmarks