'nuff said.
i believe you're thinking of the vias, when tsmc first began producing 40nm wafers they had problems with via failure and channel width. the via problem has since been fixed (amd's rv740 had double vias), but the channel width is still too large. wide channels cause leakage and extra heat, but can also provide A LOT of overclocking headroom (think amd's TWKR chips) with the right cooling. i'm looking forward to k|ngp|n's ln2 results with the 480's.
btw, word on the street is that Bx revisions of gf100 will fix the channel width problem.







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