The Fermi Thread - Part 3

[highoctane]

Common sense maybe?

Larger die = more expensive
Larger memory interface = higher complexity PCB = more expensive
Higher TDP = higher complexity PCB, better/more power components, larger heatsink = more expensive
More memory = more expensive

I said it before... GF100 will cost Nvidia more than ~2x to make than Cypress and that is being conservative.

Die in between 280 & 285 dies = similar cost to last gen assuming die size alone is the sole factor
PCB less complex than their previous 285 with smaller memory bus
Lower binned ddr5 offsets costs of larger bus

I say we can all armchair build a full product and assume manufacturing costs its not so hard....