Apart from obvious ones?
- will Bulldozer incorporate improved interconnects for MCM packaging.
- what will be maximum memory speed supported by IMC.
- how many DIMMs IMC will be able to drive (single, not MCM)
- which extensions will be supported (SSE(S3,4,4.1,4.2,AVX,3DNow,etc) and to what degree
Just a few

Bookmarks