Quote Originally Posted by cyclo View Post
Just wondering if heavier heat sinks somehow causes the boards, cpu plate, etc., to wrap a little. These wrapping (even though small) coupled with overclocking might be pushing the contacts to the limit, the spacing of which appears to be smaller on the 1156 based CPUs.

EDIT: My theory is easily disproved though if the same socket burn occurs on a water cooled 1156 based CPU.
You do understand the CPU sits on top of the bottom plastic of the socket, it is impossible to make it sit lower, unless you use a hammer, so a heat sinks weight is not the problem.