Project Millertime: The Core I5 build
Crunching/folding box on air: AMD Athlon X2 7750 Black Edition; Sapphire Radeon HD 4830; Gigabyte MA78GM-US2H; Lian Li PC-V351; Windows 7 RC
Just ordered one..........
Just praying this can play nice with the HAF932's weird 5.25 drivebay locking mechanism.
Also I didn't notice a bleed tap on top, so what are most doing ? Just adding a T-line to one of the inlet/outlets ?
I bought it was a nice way to mount the pump, but now I will split my loop into 2![]()
You tilt the whole case backwards to fill and bleed. You then tip forward to drain the system.
I was thinking about that T-line fill port, but the upper inlet isn't high enough to fill the res completely.
Project Millertime: The Core I5 build
Crunching/folding box on air: AMD Athlon X2 7750 Black Edition; Sapphire Radeon HD 4830; Gigabyte MA78GM-US2H; Lian Li PC-V351; Windows 7 RC
I know that a top fill port "feels more comfortable" because that's what we were used to, but once you try the front fill ports you will wonder why somebody didn't do this sooner. Obviously if you have an 80 pound monster cube case...not so easy of course. How often is the pump or reservoir the highest point in one of those builds though? In a normal case/install when you flip the case onto it's back the T3 becomes the highest point which allows you to bleed off ALL the air. Yes it can be a slight drag to rotate the case onto it's back, but you don't have to remove both side panels, take out the mounting screws, slide the rez forward, fill and try to bleed the air in an awkward location, slide the rez back in, replace the mounting screws, line up the reservoir so its flush again, and replace the side panels. And how do you DRAIN one of those? If you look at either the cooling loop or the oil system in your car, it's filled from the top, drained form the bottom. T3 lets you do the same thing.
Just because its a new/different way does not make it bad lol. It IS easier really.
I bled this in the same manner as Utnorris described. I tried putting the res on top and just cycling it as that worked on every hydraulic system I've worked on. Was getting no where though. Right now there are no bubbles floating around in the res. None flowing through the tubes either. The pump is silent on low speeds. There are still some tiny, really tiny bubbles stuck to the sides. I can't seem to get rid of them. Is this bled enough to run my CPU?
Will the tiny bubbles only go away with time and then another bleeding? Any tips? I'm rocking the thing back and forth and being very careful to not let the pump suck in any more air.
@ ptrout- I had to bend two tabs flat for it to fit. Others have just cut them off. I then dremeled a couple of holes so it would fit flush. Couldn't seem to achieve that using the tool less locks. Mine will just be there to cover up the dremel work.
Last edited by surfhick; 07-21-2009 at 06:36 PM.
Thanks Maxspam. I'll try that.
it does take a while to get every last bit out, which is why a res is much better than a t line to get them out is masses initially, but there will always be some tiny amount stuck somewhere and will have almost no effect, unless you can hear them
Circles SucQ!
If your annoyed by sigs telling you to put things in your sig, then put this in your sig
Bribery won't work on me...just say NO to AT!!!
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Last edited by Bei Fei; 07-21-2009 at 08:52 PM.
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3770K 5.00
7970 1200/1700
GSkill 2400
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Silverstone TJ08-E
- Koolance AC-370 - Swiftech MCP-35X - Phobya Xtreme 200mm Rad - Koolance VID-AR797 -
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I have been debating this also Skinnee, however the lip on the MM case would cover that and you would still need to either slide it forward or backwards to get to the hole. I look at it like this, I don't bleed my line daily, so the workout I got doing it was worth it. I still need to get one last bubble out, but since I have been running it for a few days now, I am pretty confident all the air is out of the rads and blocks and is sitting in the top of the res. Also, most folks with regular cases won't have an issue bleeding it. The pros of this pump/res combo easily out weigh the workout I got from bleeding.
I doubt I will tap the top, since once it is setup I shouldn't have to do it very often. I just need to stop tearing my build apart and learn to enjoy it while it is together.![]()
CPUID http://valid.canardpc.com/show_oc.php?id=484051
http://valid.canardpc.com/show_oc.php?id=484051
http://valid.canardpc.com/show_oc.php?id=554982
New DO Stepping http://valid.canardpc.com/show_oc.php?id=555012
4.8Ghz - http://valid.canardpc.com/show_oc.php?id=794165
Desk Build
FX8120 @ 4.6Ghz 24/7 / Asus Crosshair V /HD7970/ 8Gb (4x2Gb) Gskill 2133Mhz / Intel 320 160Gb OS Drive, WD 256GB Game Storage
W/C System
(CPU) Swiftech HD (GPU) EK HD7970 with backplate (RAM) MIPS Ram block (Rad/Pump) 3 x Thermochill 120.3 triple rads and Dual MCP355's with Heatkiller dual top and Cyberdruid Prism res / B*P/Koolance Compression Fittings and Quick Disconnects.
Correct on all counts. Let it run a while, the tiny bubbles will become big bubbles and get caught in the trap where you can then bleed them off. Best way to know is to LISTEN to your pump for the "air rattle"
The T3 shown there is the original bonding method that has the magnified bubble look visible from certain angles when seen from the front. The bubbles are VERY tiny and do not effect the bond at all, but because the T3 is optically clear it works like a little old ladies glasses and makes them LOOK bigger.
To be candid, the reason PrimoChill switched to the clear band (the second method) was because I complained about the bubbles at length. Since I am being candid, the reality is that I probably should have kept my mouth shut.
The second method had a 1/4" band of a clear acrylic like material on the outside which eliminated the bubbles showing in the face problem. After seeing several posts in XS and other forums where users said they were just going to use fluids with Ethylene Glycol despite the warranty Brian was worried those users would have failures down the road and beat the T3 and Primo up in the forums, despite the fact that the warranty says NO ETHYLENE GLYCOL. The clear adhesive is a brand new product on the market and there is no data on long term exposure.
The straw/amber colored material is military grade with a strong (and thoroughly tested) chemical resistance. I couldn't argue with Brian wanting a safety margin as its the better choice. Of course a batch or two got run through the bonding bot 2 or 3 times by mistake which made those units have a much thicker and wider band and the extra thickness makes the color get much darker...and everyone on the forums went WTF?
The normal single pass bond is only slightly amber or straw colored and although not a aesthetically pleasing it provides a FAR superior bond. Brian and the other shops that do post production work have been unable to find a crystal clear material for that bonding band that has the PROVEN chemical resistance a 5 year warranty requires. My shop has not given up however and I do have a promising candidate in the early testing stages.
I also designed and built the bots used in post assembly work so I am the best person to test its performance from the application perspective. Steps were taken on the punch list to insure no more parts pass QC if they are double or triple bonded.
Until I can find an adhesive that meets my requirements for optical clarity, automated delivery, and minimum 25 PSI for 10 minutes pressure testing, and meets Brian's requirement for chemical resistance (we call it the Fesser One test in house lol) the Typhoon III will ship with the light amber (single pass) bonding band.
Sorry for the long post but I just want you all to know the what's and whys of the bonding issue. I am especially sorry every time Bei Fei posts because I would be disappointed too if I were in his place. His T3 will be replaced as soon as he starts an RMA ticket at Primo or ModdersMart.
The SADDEST part of that image is that I am so old, I actually watched that episode of SNL lol.
I couldn't decide on whether to go with "wheres the fun in that?" or "As long as you never pass on a chance to tap the bottom"...
Last edited by BoxGods; 07-21-2009 at 10:12 PM.
On a brighter note, I just heard from Skinnee that the T3 testing/review is in copy editing and SHOULD be published tomorrow...well today (July 22nd) and he says I will be having a "hookers and blow" class celebration when I see the test results because the T3 "terminated" every other pump in the test group. Now I COULD comment on the so so Terminator joke, (though I am betting the "Pump You Up" post above inspired it) but what I really want to know is...when did Skinnee got a copy editor?
Sorry Cam...![]()
Last edited by BoxGods; 07-21-2009 at 10:24 PM. Reason: I had my copy editor fix a spelling error.
Thanks for the explanation and clarification![]()
I purchased mine from Moddersmart.
Thanks to everybody explaining how it might take awhile for the remaining bubbles to gather so they can be taken out. I've been wasting a lot of time trying to force it. I even fished one out with a screwdriver.
After reading BoxGods post about the bonding, I'm thinking the stripe might be good. It would never be seen in my rig unless I took it apart.
The more comments I read about its performance, the happier I am that I bought it. I saw how the pump mounted and how I could run an extra loop. That's what sold me. It nice to know that I'm getting exceptional performance too.
Project Millertime: The Core I5 build
Crunching/folding box on air: AMD Athlon X2 7750 Black Edition; Sapphire Radeon HD 4830; Gigabyte MA78GM-US2H; Lian Li PC-V351; Windows 7 RC
im not sure i follow the "forcing" part with bubbles
for me i just give my case a quick shake to rattle up and air the collected in the rads. or i will pinch the line to slow the water and release to give it a nice force of pressure. those methods are probably best done after the case has been siting for a few hours/day, its to collect the air that wasnt in the form of tiny bubbles that could easily go through the system, but to get out the ones "stuck" in various places. keep in mind i also have a heatercore for my rads, so they may have more issues with air getting stuck in them.
I am still wondering why no one has cut a hole in the top of their case to mount the res vertically, with the "front" ports, now pointing up.
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