can't get picture to load
okay, that was wierd, I copied the picture link into the address bar, it found it, then after that the picture loaded. must be to prevent deep linking
can't get picture to load
okay, that was wierd, I copied the picture link into the address bar, it found it, then after that the picture loaded. must be to prevent deep linking
i7 2600k, 8GB 1866Mhz DDR3, GTX560 Ti, Gigabyte Z68XP-UD4, CM Cosmos 1000 Case, and some green crap everywhere.Originally Posted by Alexandr0s
So you're saying I could use my own pee as coolant?
Yep, that would work better and be interesting to see. Or use solder tim to just attach fuzion waterblock to die, that way you get best of all worlds (except remounts). A waterblock that wont leak and already has good jet and surface area on inside, copper bottom of waterblock makes great IHS/heat spreader, and instead of some that have done the waterblock to die with 2-4 W/M*k paste which to me is a crap shoot versus having an IHS (mine and others gave slightly worse temps others have reported better), no doubt using solder if could get ~80 W/m*k, without IHS and without any crappy paste tim, that would give best temps...though remounts may take a little more time and effort.Yep, add a hose barb running from the inlet to the die on that diagram and that's exactly how it was. The core was getting hit hard by the water, but there's just not enough surface area for the water to absorb the heat.
I think soldering a small ramsink to the core would do wonders. Something with alot of surface area, like this:
RAM sink FTW
e8600: 6261 mhz (LN2)
e8500: 5830 mhz (dice)
It's really unfeasible, unpractical, and for all intensive purposes... SHOULD NONE THE LESS BE ATTEMPTED!
How did that german guy get 30c load @4.2ghz (i7) ?
Even chilled, that's much lower than this guy's, the only difference was the nozzle instead of using the IHS to flow water across the core.
Last edited by Bradan; 05-30-2009 at 01:33 PM.
Hardware
- Core i5 750 @ 3.6Ghz (180x20)
- Scythe Zipang 2
- 4x2Gb DDR3 (1080@7-7-7-16, 1.65v)
- Gigabyte P55-UD2
- EVGA GTX 260, Corsair 550VX, mATX case
Audio/Video
- Samsung LN32A550 32" 1080p LCD
- Asus Xonar Essence STX
- Denon AH-D2000
- Sony STR-DE197 -> Polk Audio M10
Desktop Picture
And this my friends is what, why and how XS is awesome.
fermiNow Dave will see FERMI where ever I go
So please return to the "Darkside of the Moon" and check your "Pulse" while you wait for the "Animals" that will be "Obscured By Clouds". And watch me wave as I say "Wish You Were Here" in "A Momentary Lapse of Reason"
you hit the nail right on the head phelan1777
@ fallwind Great job
German engineering in da house?
For my part I know nothing with any certainty, but the sight of the stars makes me dream.
.
.
I don't think you should bond a ram sink to the cpu. That will no longer be direct die, just a ghetto water block. I suspect your fusion is better than a ram sink.
OCZ, where life-time warranty means until we're out of stock!
Nice work, fallwind. I didn't expect, that someone would really build another direct-Die-cooler.
@YukonTrooper
@rge
Yes, the surface area is vitally important, when you use a material with "bad" heat conductivity. Some facts: The Thermal conductivity of Arctic Silver 5=7,5W/mK, Copper(99,9%)=390W/mK. Before you die trying: CNT=6000W/mK (available via Bayer AG, Laufenburg, Germany). There was a trick to get better thermal conductivity: an admixture of ...
For everybody, who knows what to do now: You haven`t seen this post. This solution is currently being patented/not disclosed until jet.
No real supprise at the results.
I remember trying this with socket A processors, but the earlyest instance I can recall is this - http://www.spodesabode.com/archive/c...cle/directdie1 on a pentium 3.
The results were still poor
The problem with direct die is that you need insane flowrates and pressures to get anything like decent results. As soon as you ramp up the pressure you will spring a leak!
yeah, I found several that had tried it and the few that posted screenshots of actual results had worse temps, and that was with cpus with much lower power density and watts than a core i7. Quite a few that tried never even posted results, at least fallwind posted honest results with a screenshot.No real supprise at the results.
I remember trying this with socket A processors, but the earlyest instance I can recall is this - http://www.spodesabode.com/archive/c...cle/directdie1 on a pentium 3.
The results were still poor
The problem with direct die is that you need insane flowrates and pressures to get anything like decent results. As soon as you ramp up the pressure you will spring a leak!
IBM has research for years and has access to nanofluids (copper or aluminum oxide or carbon nanotubules that increase 20-40% water conductivity, but that would still only be around 1 W/M*K), etc, yet they are currently milling 10,000 channels to increase surface area in cpu for their attempt at direct die cooling, which pretty much tells me it is not possible without drastically increasing surface area.
Last edited by rge; 07-31-2009 at 03:38 AM.
An admixture of 0.6 Vol.% of multi-walled CNTs in destilled water resulted in an 34% increase of thermal conductivity. Suspensions with more Vol.% were not stable, wich was the problem in the past (CNTs were difficultly soluble).
We've increased the amount of CNT up to 30Vol.%
Last edited by corross; 08-04-2009 at 03:18 AM.
Reply With Quote
Bookmarks