umm, the lower heat dissipation would be because it's clocked lower, and probably less voltage....Originally Posted by Bandwidth
They'll be lower binned aswell....
*edit*
disregard that, it didn't register that you were comparing an AM3 chip to an AM2+ chip. Man, I should go to sleep, it's past 5.AM....
If those slides are true, my next CPU is a PII 940 for sure.
But then again, even if they're not quite true, my next CPU would still probably be a PII 940 anyway.
Last edited by Apokalipse; 11-16-2008 at 10:09 AM.
The relationship between frequency and power is P=C*V^2*F, Fmax (max frequency) is related to the quality of the silicon as the inherent variability in each step toward making the CPU will cause subtle differences wafer to wafer or die to die.
As a result, Intel and AMD bin the CPUs based on various voltage, fequency max, and other criteria. But the general power relationship will always hold. If a CPU is not meeting the stability, error rate standards at 3.0 GHz but does at 2.8 GHz, then it bins there... the power naturally will come out lower overall.
Depending on the Vcc and fequency, that total power can fall within a certain power envelop. So TDP ratings are power bins, just like frequency bins ... within the TDP bin different processors will produce different thermals, but to get within that bin they simply need to be at or less a certain power mark (i.e. TDP minus an engineering margin of error).
One hundred years from now It won't matter
What kind of car I drove What kind of house I lived in
How much money I had in the bank Nor what my cloths looked like.... But The world may be a little better Because, I was important In the life of a child.
-- from "Within My Power" by Forest Witcraft
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