
Originally Posted by
savantu
Au contraire mon ami. Don't jump so fast on what I know..
GT200 is 24/24mm for a 576mm^2 chip.
You can put 93 dies on a 300mm wafer.
How do you calculate yield ? You need to know the defect density and distribution.
There are several distribution models , Poisson Model, the Murphy Model, the Exponential Model, and the Seeds Model.
Poisson is the most pessimistic , with defects spread randomly.Murphy has triangular or rectangular defect densities and is in the middle.
Exponential assumes , clustered defects and is the most optimistic one.Seeds is best suited to small chips , not the case here.
With that in mind , how about defect densities ? Intel claims world class yields 0,22-0,25 dd/cm^2.
AMD claimed "lower than 0.5" , so it must be in the 0,4-0,5dd/cm^2.
Is TSMC better than Intel or AMD ? I'd say hell no , but that's my opinion.
So let's see the results :
0,25dd/cm^2
Exponential 38 good dies , yield 41%
Murphy 26 , yield 28,1%
Poisson 22 , yield 23,7%
Average ( best+worst/2 ) 30 yield 32,3%
0,5dd/cm^2
Exponential 23 , yield 25,8%
Murphy 9 , yield 10,7%
Poisson 5 , yield 5,6%
Average 14 yield 15%
I would say that TSMC is as good as AMD at best , that's 0.5dd.In that case they get around 10-14 fully working dies per wafer , 12-15% yield.
Does that tell us how man working chips NVIDA salvages ? No.The chip has a lot of redundancy since it is build from hundreds of parallel very simple cores.
What it tell us , is that NVIDIA gets 10-14 GTX280 ( or what's it's called ) premium chips per wafer.The rest are lesser models with fewer shader/vertex/etc units.
Out of those 10-14GTX280 , some might fail running at the required frequency or in the envisioned TDP.So I'd venture to say that they get less than 10 full fledged chips per wafer.
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