First up, I take no responsibility on the outcome, but this is what I did to run this board under water:
Run your board on a stress test for an hour or so, that will soften up the thermal compound without the heat gun; doing this without placing the board in the case is ideal. Once you shut it down, go to work on the screws, then place a thick piece of plastic [old CD case, game case, whatever you can get] on the board area you are going to apply some lite pressure with a flat screwdriver [you shouldn't need to apply much strength if you run your board for at least an hour with a stress test]; your first target should be the SB heatsink as you do not want to bend the heatpipe coming from it to the NB heatsink. Once the SB is done, quickly move for the NB, now you hold the entire assembly by the heatpipe coming from the NB in both directions; get your piece of plactic and place it in a spot that will allow you to apply the lite pressure to pop the heatsink. When you remove then, they will make a kind of loud pop sound, you shouldn't be alarmed about it. The next step is the push pins for the VR heatsinks, using a pair of small pliers will do the trick there, just be careful not to scratch the board or over pressure the pins.
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