I would be a bit surprised that Xigmatek would release a version of an upcoming cooler for review that would be markedly different to final product.
I could understand the changing of the original push pin fixing mechanism to a bolt through as a reasonable, minor modification between pre release and the retail version.
But to change the thickness of the aluminium gap between the copper heat pipes is a major redesign and not something that would be made at "the 11th hour".
As you can see from the picture below, this design is more suited to a bigger die CPU.
Could it be that Xigmatek is building these coolers for the next generation x8 core CPUs?
Just a thought: If Xigmatek supplied a flat, wafer thin piece of copper, the full size of the cooler/CPU surface, to sandwich between a (say E8400) CPU and their S1284 cooler, how effective would the S1284 cooler be?
I would like to hear some of your thoughts.
Regards,
David
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