The comparisons I saw only showed it to be 3-5 degrees better than AS5, which is what the D7 seems to be getting.
The comparisons I saw only showed it to be 3-5 degrees better than AS5, which is what the D7 seems to be getting.
@Bob,
I did ask for the film for testing, I would like to know why my results varied from most. I suspect my convex waterblock has something to do with the thicker TIM.
My experience with LMP was that it is the best TIM that I have used. The idle to load temps were very close and if you through more voltage at the cpu the temps barely moved. Cleanup is another story though.
XSWCG Disclaimer:
We are not responsible for the large sums of money that you WILL want to spend to upgrade and add additional equipment. This is an addiction and the forum takes no responsibility morally or financially for the equipment and therapy cost. Thank you and have a great day.
Sigmund Freud said... "Failure to CRUNCH is a sign of Sexual Inadequacies".
Main rig:
CPU: I7 920C0 @ 3.6Ghz (180*20)
Mobo: DFI UT X58 T3eH8
RAM: 12GB OCZ DDR3-1600 Platinum
GPU/LCD: GeForce GTX280 + GeForce 8600GTS (Quad LCDs)
Intel X25-M G2 80GB, 12TB storage
PSU/Case: Corsair AX850, Silverstone TJ07
Like the name implies, it is a liquid metal. The surfaces must be extremely clean or the stuff just "puddles" up. But when everything is super clean a tiny amount spreads over the entire CPU leaving a very thin film of liquid metal. It is metal so it is very conductive so caution must be taken not to use too much.
Cleanup is a biatch, you have to lap the surfaces to remove it. Some people have experienced fusing of the block and CPU. But the performance was excellent.
XSWCG Disclaimer:
We are not responsible for the large sums of money that you WILL want to spend to upgrade and add additional equipment. This is an addiction and the forum takes no responsibility morally or financially for the equipment and therapy cost. Thank you and have a great day.
Sigmund Freud said... "Failure to CRUNCH is a sign of Sexual Inadequacies".
Bookmarks