Post Rad Chiller Concept

[littleowl]

With that said, wouldn't it be more efficient to run some kind of dual pass over the cold side of the loop, like a radiator flows and have as much "cooling water time" on the TEC's cold side as possible, why just run the water down the shoot once, loop it back and have both the input and output on one side, again just like a radiator. I think you will add a little more flow resistance to the loop but the gain from using the TEC's cooling more efficiently by giving the water more cold face time would be much more beneficial.

not really. the water will only pick up so much heat. so if you do a double pass or even more you will just carry all the heat from one pelt to the other pelt. if you look at the maze4-1 from danger den you will see the same thing in a way. but only for 1 tec. The reason the maze was never a very good tec block was because one side of the tec got cool while the other side stayed hot.

[systemviper]

not really. the water will only pick up so much heat. so if you do a double pass or even more you will just carry all the heat from one pelt to the other pelt. if you look at the maze4-1 from danger den you will see the same thing in a way. but only for 1 tec. The reason the maze was never a very good tec block was because one side of the tec got cool while the other side stayed hot.

I'm not sure what you mean, I would have a separate heat dissipation loop with say 3 - maze 4's, 1 on the back of each of the 3 pelts running to a seperate loop of a 120.3's or 2.....to remove the heat with out impacting the cooling of the water in the "Martin rig" so the water is only coming in contact with the cooling side of the pelt and making the second pass just gaining more cooling as it moves thru the martin rig. My objective is to get the water as cooled as possible....

[NaeKuh]

the cold side is going to be connected to an RD-30, PA120.3, EK Supreme, MCW30.

The hotside will be a very small loop with only a EK-XRES PA160 and a DDC3.2

I highly doubt i'll be lacking in the flow department for either side of the loop.

[systemviper]

the cold side is going to be connected to an RD-30, PA120.3, EK Supreme, MCW30.

The hotside will be a very small loop with only a EK-XRES PA160 and a DDC3.2

I highly doubt i'll be lacking in the flow department for either side of the loop.

Yea, sorry to be a little off topic, i was thinking of making it better for my use with a dual pass cooling loop, and not for your system.

Sorry for the hijack, now back to your regularly scheduled thread.

[littleowl]

I'm not sure what you mean, I would have a separate heat dissipation loop with say 3 - maze 4's, 1 on the back of each of the 3 pelts running to a seperate loop of a 120.3's or 2.....to remove the heat with out impacting the cooling of the water in the "Martin rig" so the water is only coming in contact with the cooling side of the pelt and making the second pass just gaining more cooling as it moves thru the martin rig. My objective is to get the water as cooled as possible....

that is fine on the cold side but what about the hot side? the hot side has to be cooled and that is what I was talking about. he may gain some if he did multi pass on the cold side loop idk that he would gain enough for the extra time involved

[systemviper]

that is fine on the cold side but what about the hot side? the hot side has to be cooled and that is what I was talking about. he may gain some if he did multi pass on the cold side loop idk that he would gain enough for the extra time involved

Yea, but I was more referring to MY idea and not thinking about his needs,

For my needs i would mount a maze4 on the back of each pelt (hot side) in a separate loop and solve the heat issue so the cooling would be sweet on the dual pass (cold side), i would even think of going triple or quad pass myself, just to keep the water on the cold side of the pelts as long as possible, then run it straight into the cpu petl block, but we have 2 different objectives, he is looking to drop his temps by a bit and run 24/7; I am looking to get my CPU as low as she can go for benching numbers....

Again sorry for being off topic...

[Martinm210]

FYI
Fabrication is in progress, this must be the biggest workpiece I've milled yet...

RAW Materials...



Lathe put away, and chips are flying on the mill...


I'll keep taking photos of the progress and post them here for fun..

I'll try to answer a few questions:

The base is being constructed from 1/4" copper. I think one thing that is being confused here regarding thickness is a cold plate vs a CPU block design. You NEED thickness when you're trying to transfer heat being collected from one area to another. Because this block has full channel coverage, extra thickness is not necessary and will only act as more of an insulator than anything. I'm purposfully leaving the pin hieght .100" to allow a very small amount of water to pass over the top of the pins as well. Overall a simple channel design like this will approximately double the heat transfer area. This will leave about .150 thickness for the base. I think a combination of .150 base thickness and the .750 delrin should provide an adequate amount of bending resistance to sandwich the TEC. The block will be big enough for either 4x 40mm TECs or 3X 62mm TECs.

Naekuh and I discussed keeping the fin design simple, so they are going to be 1/8" channels wide, this will also minimize the pressure drop in the actual chilled CPU loop, so you are not taking a big hit there. It could very well be a pin matrix design, but youre all aware of the pressure drop of a standard Apogee GTX, the distance from barb to barb is only about 1.5 inches or so, imagine the pressure drop having 5X that length. I think you need to be careful about pressure drop on something this big especially on the cold side were you still need good flow rates to keep the CPU block cool. Also milling diamond pins is extraordinarily time consuming, I've spent as much as 4 hours milling a small diamond pin matrix for a CPU block. I'm not a CNC machine...