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Thread: Water cooling the Asus Maximus SE X38

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  1. #10
    Xtreme Mentor
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    Sep 2007
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    O.K. ...

    I took the advice, and also looked at the AS home page and read about Arctic Silver Thermal Adhesive. It is not to be used on CPU's but is made for chips just like our SB.
    I decided to go for it and attached my favorite sink for the job, (The Enzotech Forged Copper CNB-S1L), directly to my SB chip using Arctic Silver Thermal Adhesive.
    Thanks ~aoe~ for the sink info.

    The AS Home page has this:
    http://www.arcticsilver.com/arctic_s...l_adhesive.htm

    Thermal Adhesive Temperature range:
    - 40C to >150C (Bond strength is weakened at temperatures below 0C due to crystallization.)

    I think my normal SB operating temps should stay within that range...

    I like the Caution!!: Arctic Silver Thermal Adhesive is a permanent adhesive.
    Components you attach with Arctic Silver Thermal Adhesive will stay attached forever.

    Staying attached forever, sounds like this stuff playes for keeps! That is exactly what I'm looking for...

    Note: The Enzotech Forged Copper (CNB-S1L) is sold as a NB cooling sink.
    I will only be giving it a SB workload assignment on the Maximus, so it should do a fine job for me!
    I just feel like with the sink being stuck directly to the chip, should yield some low SB temps....
    Good deal.

    Note: The stock SB cooler might be fine, but it is not copper like this Bad Boy.

    I am hoping this will prove to be an upgrade for me. My chip to sink contact, is now much better than it was stock.
    I did have to give up the Fusion cooling pipe, and any thermal advantage that it did bring to the SB....
    My money says the Arctic Silver Thermal Adhesive would also beat the ASUS stock goop, in a thermal performance test...
    Guess we shall have to see after all the smoke clears...

    I did get the sink, and lines on the mobo all lined up pritty good too.
    No need for a backplate for this SB rig.

    I let it set about 12 hours this way, with the weight on it....
    I think the extra weight the NB back plate added, made my 'chip to sink' contact a wee bit better!!
    The next guy might miss that.

    I put the cardboard in there to insure my sink didn't make permanent contact with any caps.
    I didn't want them to brunt any of the heat from being in constant contact with the sink.

    I didn't cutt my sink in any way, just took the pins out.
    Every last g of the sinks glorious copper, will be used for cooling my SB.
    Last edited by Talonman; 12-05-2007 at 06:37 PM.
    Asus Maximus SE X38 / Lapped Q6600 G0 @ 3.8GHz (L726B397 stock VID=1.224) / 7 Ultimate x64 /EVGA GTX 295 C=650 S=1512 M=1188 (Graphics)/ EVGA GTX 280 C=756 S=1512 M=1296 (PhysX)/ G.SKILL 8GB (4 x 2GB) SDRAM DDR2 1000 (PC2 8000) / Gateway FPD2485W (1920 x 1200 res) / Toughpower 1,000-Watt modular PSU / SilverStone TJ-09 BW / (2) 150 GB Raptor's RAID-0 / (1) Western Digital Caviar 750 GB / LG GGC-H20L (CD, DVD, HD-DVD, and BlueRay Drive) / WaterKegIII Xtreme / D-TEK FuZion CPU, EVGA Hydro Copper 16 GPU, and EK NB S-MAX Acetal Waterblocks / Enzotech Forged Copper CNB-S1L (South Bridge heat sink)

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